JPS6022824B2 - Manufacturing method for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a manufacturing method such as heat treatment and solder plating for electronic components such as diodes.

For example, a glass-sealed diode generally has a structure as shown in FIG.

In this Figure 1, 1 is a diode element, 2 and 3 are lead conductors electrically connected to the electrodes on both sides of element 1, and 4 and 5 are end faces welded to the outside of each lead conductor 2 and 3. External lead wires 6 are made of glass that hermetically seals the diode element 1, and the lead wires 4 and 5 are led out in opposite directions. and,
Such diodes were manufactured through the following steps. First, a heater jig 8 as shown in FIG. 2 was used to heat-treat the component body 7.

That is, this jig 8 has a large number of component storage holes 9 arranged on the top surface, and a door hole 10 that penetrates from the center of the bottom surface of each component storage hole 9 to the bottom surface of the jig. tube 6'
The output conductor 2, the element 1, and the output conductor 3 are sequentially inserted. At this time, the lead wire 4 end face welded to one outlet conductor 2 passes through the lead hole 10 and protrudes from the lower surface of the jig 8, and the end face welded lead wire 5 to the other outlet conductor 3 It protrudes from the upper surface of the jig 8. Then, hold the upper end of each lead wire 5 protruding upward and press it downward with the holding plate 11 to force each □ output conductor 2, 3 to the element 1, and apply current to the lining 3. Heat to melt the glass tube 6'.
Then, the glass tube 6' settles on each □output conductor 2, 3,
Sealing glass 6 is formed. Note that this glass sealing is performed in a vacuum or nitrogen gas atmosphere. When the heat treatment of the component body 7 is completed in this way, the next step is to take out each diode from the common smell 8, and connect the lead wires 4, 5 to prevent oxidation.
Perform solder plating in Step 5.

In this solder plating process, when the lead wires 4 and 5 are made of a magnetic material such as iron, as shown in FIG. In this state, the magnet 12 is lowered into the solder liquid 14 in the solder bath 13, and the lower IJ-
The soldering wire 5 or 4 was immersed in the solder liquid 14. Then, when the solder plating of one lead wire 5 or 4 is completed,
Pull up the magnet 12 and remove the diode from the magnet 12. Next, perform plating heat treatment or attract the one lead wire 5 or 4 to the magnet 12, perform the above operation, and then remove the other lead wire 4 or 5.
solder plate to. When this solder plating is completed, each diode is removed from the magnet 12 by hand or the like, and in the next characteristic check step, the magnet is used again to align and trowel, and a current is passed through each diode to check the characteristics.

After that, they were sent to the polarity marking process and turned into products. However, such conventional manufacturing methods have the following drawbacks.

First, the diode alignment configurations in each process, such as the heat treatment process, solder plating process, and characteristic checking process, are different, and therefore, it is necessary to re-align and refill the diodes between processes, resulting in poor workability. Moreover, this made quality control, yield control, quantity control, etc. on a batch-by-batch basis difficult. or,
In the case of the solder plating process, the lead wires 4 and 5 must be made of a magnetic material in order to align the diodes with the magnet 12, and if the lead wires 4 and 5 are made of a non-magnetic material such as copper, special This was inconvenient because it required a chuck mechanism to align the diodes and barrel plating soldering.
In addition, when holding a diode suspended from the magnet 12 and performing solder plating, the solder bonding mechanism must be quite complex and precise in order to prevent solder from reaching the component body 7. Ta. Furthermore, during solder dipping, the holding of the diode is unstable, so when the magnet 12 is raised to pull up the lead wires 4 or 5 from the solder liquid 14, the adjacent lead wires come into contact with each other, causing both to become unstable. Soldering problems were occurring frequently. The present invention improves and eliminates the drawbacks of the above-mentioned conventional method, and manufactures electronic components by consistently maintaining the same odor control from the heat treatment process to the solder plating process and subsequent processes. provide a method. When the present invention is applied to manufacturing the above-mentioned diode, a component alignment pick 15 as shown in FIGS. 4 and 5, for example, is used.

This component alignment jig 15 also serves as a heater, and is composed of a jig main body 16 and two upper and lower thin plates 17 and 18. The jig body 16 has a large number of through holes 19 into which the diode component body 7 is inserted, and the upper and lower thin plates 17,
18 has lead wires 4 and 5 at positions corresponding to the through holes 19.
Lead holes 20 and 21 are respectively drilled into which the lead holes 20 and 21 are inserted. Then, the thin plates 17 and 18 are tightly fixed to the upper and lower surfaces of the jig main body 16 by means of screws or the like. below,
The manufacturing method of the present invention using this component alignment jig 15 will be explained in sequence. First, the thin plate 18 is fixed to the lower surface of the pick-up main body 16. Then, the glass tube 6' is inserted into the through hole 19 of the pick body 16, and then the outlet conductor 2 integrated with the lead wire 4 is inserted into the glass tube 6', and the lead wire 4 is inserted into the lead hole of the thin plate 18. 2
The element 1 and the other output conductor 3 are inserted sequentially from above the lead conductor 2. Then, the lead wire 5 protruding from the upper surface of the vulgar body 16 is inserted into the lead hole 20 of the thin plate 17 to fix the thin plate 17 to the upper surface of the jig body 16. This is the state shown in FIG. 5, and at this time each lead wire 4, 5 is made so that the outside from the root which does not require solder plating protrudes from each board 17, 18. Thereafter, it is sent to each process in the state shown in FIG. 5 and processed as follows. That is, in the case of the heat treatment process, as shown in FIG.
The component alignment jig 16 is fixed, each lead wire 5 protruding upward is pressed by the holding plate 22, and a current is applied to the component alignment pick 15 to heat it, and the glass tube in the through hole 19 is heated. 6
′ is melted.

This heating is performed in a vacuum or in a nitrogen gas atmosphere, if necessary. Also, during this heating, in order to make the heating temperature distribution to the glass tube 6' more uniform, sixth
A heater 23 as shown by the chain line in the figure may be added. or,
The molten glass tube 6' is welded to the outlet conductors 2 and 3 to form the sealing glass 6. At this time, in order to prevent the molten glass from welding to the odor control side, the jig side should be placed so that it is compatible with the glass. Form it with bad things. Next, when the sealing by heat treatment is completed, the component alignment jig 15 with the diodes aligned is taken out and transported as is to the next solder plating process.

In the solder plating process, as shown in FIG. 7, the solder wires 4 protruding from the bottom surface of the component alignment jig 15 are first submerged in the solder liquid 25 in the solder tank 24 and solder plated, and then the components are aligned. Flip the jig 15 up and down by 180qC and attach it to the other IJ.
The wire 5 is immersed in a solder liquid 25 and plated with solder. Since this solder plating is performed up to the vicinity of the roots of the lead wires 4 and 5,
It is desirable that the thin plates 17 and 18 forming the upper and lower surfaces of the component alignment jig 15 be made of a material that does not easily adhere to solder.
Also, during this solder plating process, the lead wires 4 and 5 are usually heated slightly, but if the lead wires 4 and 5 were heated to a high temperature in the previous heat treatment process, the lead wires 4 and 5 are appropriately slowly cooled and soldered. If the temperature is maintained at the appropriate temperature during plating, there will be no need for heating. When the solder plating process is completed in this way, the component alignment jig 15 is sent as it is to subsequent processes, such as a characteristic checking process, a polarity discrimination process, a polarity marking process, etc.

Then, by disassembling the component alignment pick 15 at an appropriate time, each diode can be taken out individually. The component alignment jig 15 has a structure in which thin plates 17 and 18 are superimposed on the upper and lower surfaces of the odor pickup main body 16, respectively, but at least one of these two thin plates 17 and 18 is not necessarily required, for example, as shown in FIG. It is also possible to use a component alignment pick 15' shown in FIG.

The jig main body 16' of this parts alignment pick-up tool 15' has a shape in which the pick-up main body 16 shown in FIG. The same is true. Note that the present invention is applicable not only to the manufacture of diodes but also to the manufacture of electronic components such as resistors.

As explained above, according to the present invention, various treatments such as heat treatment and solder plating are performed while a large number of electronic components are aligned and held in one jig, so electronic components can be aligned and repacked between processes. In addition, quality control, yield control, and quantity control on a patch-by-patch basis can be easily performed, and the risk of mixing electronic components of different types with completely different characteristics during manufacturing is also eliminated.

In addition, especially in the solder plating process, since the support of the lead wires is stable, there is no need to worry about problems such as adjacent lead wires being soldered together, and if the lead wires are made of non-magnetic material. Even if it is, solder can be easily immersed.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of a diode, Fig. 2 is a schematic sectional view showing a conventional example of a diode heat treatment apparatus, Fig. 3 is a schematic sectional view showing a conventional example of a diode solder plating processing apparatus, and Fig. 4 is a schematic sectional view showing a conventional example of a diode heat treatment apparatus. An exploded perspective view showing an embodiment of the component alignment jig used in the method of the present invention, FIG. 5 is a cross-sectional view of the pick-up tool shown in FIG. FIG. 7 is an explanatory view during solder plating according to the present invention, and FIG. 8 is a sectional view showing another embodiment of a component alignment jig used in the method of the present invention. 4, 5... Lead wire, 7... Part body, 15, 15
'...Parts alignment pick-up tool, 16,16'...Jig body,
17, 18...Thin plate, 19...Through hole. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Completed Figure 8

Claims (1)

[Claims] 1. In a method of manufacturing an electronic component in which lead wires are led out from the component body in opposite directions, a jig body in which the component body is inserted into a large number of through holes, and the lead wires protruding from the through holes are used. A component alignment jig that aligns and supports a large number of electronic components is used, and this component alignment jig is equipped with a thin plate that is inserted through the jig body and overlaps with the jig body to prevent the component body from coming off from the through hole. A method of manufacturing an electronic component, characterized in that the component body in the through hole is heat treated, and the components are aligned with the component alignment jig, and then each process of plating protruding lead wires is performed.