JPH0213809B2 - - Google Patents
Info
- Publication number
- JPH0213809B2 JPH0213809B2 JP57026931A JP2693182A JPH0213809B2 JP H0213809 B2 JPH0213809 B2 JP H0213809B2 JP 57026931 A JP57026931 A JP 57026931A JP 2693182 A JP2693182 A JP 2693182A JP H0213809 B2 JPH0213809 B2 JP H0213809B2
- Authority
- JP
- Japan
- Prior art keywords
- coil bobbin
- chip capacitor
- solder
- coil
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 30
- 238000005476 soldering Methods 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 239000002131 composite material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 238000004804 winding Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Description
【発明の詳細な説明】
本発明はインダクタンス部品とコンデンサ部品
とを１つのユニツトとしたLC複合部品の巻線配
線後のデイツプ・ソルダリング処理方法およびそ
の半田付け装置に関するもので、その目的とする
ところは半田付け温度の異なる部品の半田付け作
業において、部品の信頼性を低下させることなく
同時に処理できるものを提供することにある。[Detailed Description of the Invention] The present invention relates to a method for dip soldering after winding wiring of an LC composite component including an inductance component and a capacitor component as one unit, and a soldering device thereof. The object of the present invention is to provide a method that can simultaneously solder parts with different soldering temperatures without reducing the reliability of the parts.
本発明の対象となるLC複合部品は第２図ａ，
ｂのように構成されている。１は巻線部にポリウ
レタン銅線２が巻装されコンデンサ溝部にチツプ
コンデンサ３が挿入されるコイルボビン、４ａ，
４ｂはコイルボビン１の長手方向に直交する方向
に突出された端子である。なお、前記コンデンサ
溝部は挿入されたチツプコンデンサ３の両端の電
極５ａ，５ｂが端子４ａ，４ｂに接触するよう形
成されている。また、ポリウレタン銅線２の巻始
めおよび巻終りの配線部は端子４ａ，４ｂに配線
され、前記チツプコンデンサ３の電極５ａ，５ｂ
と共に端子４ａ，４ｂに半田付けされている。 The LC composite parts targeted by the present invention are shown in Figure 2a,
It is configured as shown in b. 1 is a coil bobbin in which a polyurethane copper wire 2 is wound around a winding portion and a chip capacitor 3 is inserted into a capacitor groove; 4a;
4b is a terminal protruding in a direction perpendicular to the longitudinal direction of the coil bobbin 1. The capacitor groove is formed so that the electrodes 5a and 5b at both ends of the inserted chip capacitor 3 come into contact with the terminals 4a and 4b. Further, the wiring portions at the beginning and end of the winding of the polyurethane copper wire 2 are wired to the terminals 4a, 4b, and the electrodes 5a, 5b of the chip capacitor 3 are wired to the terminals 4a, 4b.
They are also soldered to the terminals 4a and 4b.
半田付け装置の基本構成は第１図に示すよう
に、矢印方向に回転するテーブル６に装着され
たチヤツク７に、ステーシヨンＡで前記コイルボ
ビン１を半田付け部８が下方となるよう挿入し、
次いでステーシヨンＢで半田付け部８にフラツク
ス塗布を行い、ステーシヨンＣでデイツプ・ソル
ダリングの後、ステーシヨンＤではチヤツク７か
らコイルボビン１を抜き取つて次工程に供給する
構成となつている。 As shown in FIG. 1, the basic configuration of the soldering apparatus is as follows: At station A, the coil bobbin 1 is inserted into a chuck 7 mounted on a table 6 that rotates in the direction of the arrow, with the soldering part 8 facing downward.
Next, flux is applied to the soldering portion 8 at station B, dip soldering is performed at station C, and then coil bobbin 1 is extracted from chuck 7 at station D and supplied to the next process.
第３図ａ，ｂはステーシヨンＣの構成を示し、
９は半田槽、１０は上下動手段２５により矢印
のように昇降して半田槽９から溶融半田１１を汲
み上げる半田バケツトで、チヤツク７によつて保
持されたコイルボビン１の半田付け部８が第３図
ｂのように溶融半田１１中に浸され、全て端子４
ａ，４ｂへのチツプコンデンサ３の電極５ａ，５
ｂとポリウレタン銅線２を同時に半田付けする。 Figures 3a and 3b show the configuration of station C,
9 is a solder tank; 10 is a solder bucket which is raised and lowered in the direction of the arrow by a vertical moving means 25 to draw up molten solder 11 from the solder tank 9; All terminals 4 are immersed in molten solder 11 as shown in Figure b.
electrodes 5a, 5 of chip capacitor 3 to a, 4b
b and polyurethane copper wire 2 at the same time.
しかし、このような従来のデイツプ・ソルダリ
ング処理方法によると、チツプコンデンサ３自体
の端子４ａ，４ｂへの半田付けが低温で可能であ
るにもかかわらず、チツプコンデンサ３はポリウ
レタン銅線２の端子４ａ，４ｂへの半田付けのた
めにその数倍以上の高温にさらされて、チツプコ
ンデンサ３に許容限度以上の高温がかかることに
なり、チツプコンデンサ３にサーマルクラツク、
電極の食われが発生して、LC複合部品の信頼性
低下の原因となつている。 However, according to such a conventional dip soldering processing method, although the chip capacitor 3 itself can be soldered to the terminals 4a and 4b at a low temperature, the chip capacitor 3 is soldered to the terminals of the polyurethane copper wire 2. Due to soldering to 4a and 4b, the chip capacitor 3 is exposed to a high temperature several times higher than that, and the chip capacitor 3 is exposed to a high temperature exceeding the allowable limit, causing a thermal crack to the chip capacitor 3.
Electrode erosion occurs, causing a decrease in reliability of LC composite parts.
チツプコンデンサの両端に形成された電極と、
コイルの配線部とを、コイルボビンの長手方向に
直交する方向に突出された複数の端子に、それぞ
れ接触させてデイツプ・ソルダリングするに際
し、前記コイルボビンをその長手方向を中心に回
動させ傾斜させて保持し、次いで半田槽と前記コ
イルボビンとを相対的に近づけて、前記チツプコ
ンデンサを除いてチツプコンデンサの一方の電極
と前記コイルの配線部と前記コイルボビンの端子
のみを半田浸しして、半田液面とチツプコンデン
サとの接触面積を減少させてチツプコンデンサへ
の伝熱量を低減し、信頼性の低下を防止するもの
である。また、コイルボビンを軸心方向がコイル
ボビン長手方向の２本のピンの端部間で挾持する
保持手段と、前記チヤツクピンの少なくとも一方
を、その軸心まわりに回動させてLC複合部品を
回動傾斜させる回動駆動手段と、この回動駆動手
段によつて傾斜されたコイルボビンの端子とチツ
プコンデンサの電極とコイルの配線部のみを同時
に溶融半田に浸すために、溶融半田が入れられた
半田バケツトを上下動させる上下動手段とを設け
ることによつて、上記斜め半田付け方法を効率よ
く実施することができる。 Electrodes formed at both ends of the chip capacitor,
When deep soldering is performed by bringing the wiring portion of the coil into contact with a plurality of terminals protruding in a direction perpendicular to the longitudinal direction of the coil bobbin, the coil bobbin is rotated around its longitudinal direction and tilted. Then, the solder bath and the coil bobbin are brought relatively close together, and except for the chip capacitor, only one electrode of the chip capacitor, the wiring part of the coil, and the terminal of the coil bobbin are immersed in solder, and the solder liquid level is lowered. This reduces the contact area between the chip capacitor and the chip capacitor, thereby reducing the amount of heat transferred to the chip capacitor and preventing a decrease in reliability. Further, the LC composite component is rotated and tilted by rotating at least one of the chuck pins and a holding means for holding the coil bobbin between the ends of two pins whose axial center direction is the longitudinal direction of the coil bobbin. In order to simultaneously immerse only the terminals of the coil bobbin, the electrodes of the chip capacitor, and the wiring portion of the coil tilted by the rotation drive means in the molten solder, a solder bucket containing molten solder is placed. By providing a vertical movement means for vertical movement, the diagonal soldering method described above can be carried out efficiently.
先ず、本発明の斜め半田付け方法の原理を説明
する。 First, the principle of the diagonal soldering method of the present invention will be explained.
一般に固体および流体間の伝熱量Ｑは、
Ｑ＝α（ts−tf）Ｓ 〔Kcal／ｈ〕
（但し、αは熱伝達率、Tsは半田温度、tfはチツ
プ温度、Ｓは接触面積）
で表わされる。上式からチツプコンデンサへのプ
リヒートによるtfの上昇および接触面積Ｓの低減
を図れば伝熱量Ｑを低減できることがわかる。し
かし、プリヒートについては製品構造上、樹脂製
ボビンが使用されるなどにより、そのプリヒート
温度には限界があり、その効果は非常に少なく、
接触面積Ｓを減らす以外に伝熱量Ｑを低減するこ
とはできない。 In general, the amount of heat transfer Q between a solid and a fluid is Q = α (t s − t f ) S [Kcal/h] (where α is the heat transfer coefficient, T s is the solder temperature, t f is the chip temperature, and S is contact area). From the above equation, it can be seen that the amount of heat transfer Q can be reduced by increasing t f and reducing the contact area S by preheating the chip capacitor. However, due to the structure of the product and the use of resin bobbins, there is a limit to the preheating temperature, and its effectiveness is very small.
The amount of heat transfer Q cannot be reduced other than by reducing the contact area S.
以下本発明の具体的な一実施例を第４図〜第８
図に基づいて説明する。なお、第２図と第３図と
同様の作用を成すものには同一符号を付けてその
説明を省く。 A specific embodiment of the present invention is shown in FIGS. 4 to 8 below.
This will be explained based on the diagram. Components having the same functions as those in FIGS. 2 and 3 are designated by the same reference numerals, and their explanations will be omitted.
１２はパレツトで、コイルボビン１が半田付け
部８を上にして第４図のように置かれる。１３は
保持手段で、軸心方向がコイルボビン１の長手方
向に配置され、端部間でパレツト１２上のコイル
ボビン１を挾持する２本のチヤツクピン１４ａ，
１４ｂと、一方のチヤツクピン１４ａを他方のチ
ヤツクピン１４ｂ側〔矢印方向〕に付勢するば
ね１５とから成る。１６は前記他方のチヤツクピ
ン１４ｂをその軸心まわりに回動させる回動駆動
手段で、チヤツクピン１４ｂに取付けられたピニ
オン１７と、このピニオン１７に係合するラツク
１８を有する。 12 is a pallet on which the coil bobbin 1 is placed with the soldering part 8 facing upward as shown in FIG. Reference numeral 13 denotes a holding means, which includes two chuck pins 14a whose axial centers are arranged in the longitudinal direction of the coil bobbin 1, and which hold the coil bobbin 1 on the pallet 12 between the ends thereof.
14b, and a spring 15 that urges one chuck pin 14a toward the other chuck pin 14b (in the direction of the arrow). Reference numeral 16 denotes rotation driving means for rotating the other chuck pin 14b about its axis, and has a pinion 17 attached to the chuck pin 14b and a rack 18 that engages with the pinion 17.
なお、前記チヤツクピン１４ａは先端が円錐形
に形成されており、この先端がコイルボビン１の
センター孔１９に係合し、チヤツクピン１４ｂの
先端は第６図ａ，ｂのようにコイルボビン１のセ
ンター孔１９に係合する円錐部２０とコイルボビ
ン１の端面の切欠き部２１と突出部２２にそれぞ
れ係合する凸部２３，２４を有し、コイルボビン
１はこのチヤツクピン１４ｂによつて位置（角
度）規制される。 The tip of the chuck pin 14a is formed into a conical shape, and this tip engages with the center hole 19 of the coil bobbin 1, and the tip of the chuck pin 14b engages with the center hole 19 of the coil bobbin 1 as shown in FIGS. 6a and 6b. The coil bobbin 1 has a conical portion 20 that engages with the chuck pin 14b, and convex portions 23 and 24 that engage with the notch 21 and the protrusion 22 on the end surface of the coil bobbin 1, respectively, and the position (angle) of the coil bobbin 1 is regulated by the chuck pin 14b. Ru.
半田付け作業は、チヤツクピン１４ａ，１４ｂ
でコイルボビン１を挾持して第５図のようにパレ
ツト１２からコイルボビン１を抜き取り、次にラ
ツク１８を駆動してチヤツクピン１４ｂを所定角
度だけ回動させ、コイルボビン１を第７図ａの姿
勢から第７図ｂのように矢印方向に回動させ
て、コイルボビン１をチツプコンデンサ３の電極
配線方向〔矢印方向〕に角度θだけ傾斜させて
保持する。そしてこの状態のままチヤツクピン１
４ａ，１４ｂを移動させて半田付け部８にフラツ
クスを塗布し、上下動手段２５（第３図ａ参照）
により上動された半田バケツト１０で汲み上げた
溶融半田１１に第８図のように一方の半田付け部
８のみを先ず浸して端子４ａ側の半田付けを行
い、上下動手段２５により半田バケツト１０を一
旦下降させ、引き続いてラツク１８によつてチヤ
ツクピン１４ｂを回動させて他方の半田付け部８
の端子４ｂ側についてもコイルボビン１を傾斜さ
せて同様にデイツプ・ソルダリングを行つた後、
コイルボビン１を第７図ａの姿勢に復帰させてパ
レツト１２に戻される。 For soldering work, use the chuck pins 14a and 14b.
5, the coil bobbin 1 is held between the coil bobbin 1 and the pallet 12 as shown in FIG. The coil bobbin 1 is held at an angle θ in the direction of the electrode wiring of the chip capacitor 3 (in the direction of the arrow) by rotating it in the direction of the arrow as shown in FIG. 7b. And in this state, check pin 1
4a and 14b to apply flux to the soldering part 8, and move the vertical movement means 25 (see Fig. 3a).
As shown in FIG. 8, only one soldering part 8 is first immersed in the molten solder 11 pumped up by the solder bucket 10 which has been moved upward to solder the terminal 4a side. Once lowered, the chuck pin 14b is rotated by the rack 18, and the other soldering part 8 is
After tilting the coil bobbin 1 and performing dip soldering in the same manner on the terminal 4b side,
The coil bobbin 1 is returned to the position shown in FIG. 7a and returned to the pallet 12.
このように半田付け状態は、チツプコンデンサ
３の電極部のみ半田液面と接触しており、従来に
比べて大幅に伝熱量がおさえられ、チツプコンデ
ンサ３に無理をかけることなくチツプコンデンサ
３の電極とポリウレタン銅線２を同時に端子４ａ
または４ｂに半田付けすることができる。 In this way, in the soldered state, only the electrodes of the chip capacitor 3 are in contact with the solder liquid surface, and the amount of heat transfer is significantly suppressed compared to the conventional method. and polyurethane copper wire 2 to terminal 4a at the same time.
Or it can be soldered to 4b.
以上説明のように本発明によると、半田付け温
度の異なるチツプコンデンサとコイルの配線部と
を高温に弱い前記チツプコンデンサに無理をかけ
ることなく同時にデイツプ・ソルダリングするこ
とができ、チツプコンデンサにサーマルクラツク
や電極の食われの発生もなく、半田付けの際の
LC複合部品の信頼性の低下の問題を回避できる。
また、本発明の半田付け装置によると、構成簡単
にして斜め半田付け処理を実行できるものであ
る。 As explained above, according to the present invention, it is possible to dip-solder a chip capacitor having different soldering temperatures and a wiring part of a coil at the same time without applying any force to the chip capacitor, which is vulnerable to high temperatures, and to apply thermal insulation to the chip capacitor. No cracks or erosion of the electrodes, and it is easy to solder.
The problem of reduced reliability of LC composite parts can be avoided.
Further, according to the soldering device of the present invention, it is possible to perform diagonal soldering processing with a simple configuration.
第１図は半田付け装置の基本構成図、第２図
ａ，ｂはLC複合部品の正面図と側面図、第３図
ａ，ｂは従来の半田付け装置の正面図と要部側面
図、第４図〜第８図は本発明の一実施例を示し、
第４図はチヤツク保持前のボビンの状態図、第５
図はチヤツクのボビン保持状態図、第６図ａ，ｂ
はチヤツクピンの斜視図とチヤツクピンとボビン
との係合状態説明図、第７図ａ，ｂはボビンの傾
斜状態説明図、第８図は半田付け状態説明図であ
る。
１…コイルボビン、２…ポリウレタン銅線、３
…チツプコンデンサ、４ａ，４ｂ…端子、８…半
田付け部、９…半田槽、１０…半田バケツト、１
３…保持手段、１４ａ，１４ｂ…チヤツクピン、
１６…回転駆動手段、１７…ピニオン、１８…ラ
ツク、２５…上下動手段。
Fig. 1 is a basic configuration diagram of a soldering device, Fig. 2 a and b are a front view and a side view of the LC composite component, Fig. 3 a and b are a front view and a side view of main parts of a conventional soldering device, 4 to 8 show an embodiment of the present invention,
Figure 4 is a state diagram of the bobbin before chuck is held, Figure 5
The figure is a diagram of the bobbin holding state of the chuck, Fig. 6 a, b
7 is a perspective view of the chuck pin and an explanatory diagram of the engagement state between the chuck pin and the bobbin, FIGS. 7a and 7b are explanatory diagrams of the tilted state of the bobbin, and FIG. 8 is an explanatory diagram of the soldering state. 1... Coil bobbin, 2... Polyurethane copper wire, 3
...Chip capacitor, 4a, 4b...Terminal, 8...Soldering part, 9...Solder tank, 10...Solder bucket, 1
3... Holding means, 14a, 14b... Chuck pin,
16... Rotation drive means, 17... Pinion, 18... Rack, 25... Vertical movement means.
Claims (1)
と、コイルの配線部とを、コイルボビンの長手方
向に直交する方向に突出された複数の端子に、そ
れぞれ接触させてデイツプ・ソルダリングするに
際し、前記コイルボビンをその長手方向を中心に
回動させ傾斜させて保持し、次いで半田槽と前記
コイルボビンとを相対的に近づけて、前記チツプ
コンデンサを除いてチツプコンデンサの一方の電
極と前記コイルの配線部と前記コイルボビンの端
子のみを半田浸しするLC複合部品における斜め
半田付け方法。 ２ コイルボビンを、軸心方向がコイルボビン長
手方向の２本のチヤツクピンの端部間で挾持する
保持手段と、前記チヤツクピンの少なくとも一方
を、その軸心まわりに回動させてLC複合部品を
回動傾斜させる回動駆動手段と、この回動駆動手
段によつて傾斜されたコイルボビンの端子とチツ
プコンデンサの電極とコイルの配線部のみを同時
に溶融半田に浸すために、溶融半田が入れられた
半田バケツトを上下動させる上下動手段とを設け
たLC複合部品の斜め半田付け装置。[Claims] 1. Deep soldering by bringing the electrodes formed at both ends of the chip capacitor and the wiring part of the coil into contact with a plurality of terminals protruding in a direction perpendicular to the longitudinal direction of the coil bobbin. When doing so, the coil bobbin is rotated around its longitudinal direction and held at an angle, and then the solder bath and the coil bobbin are brought relatively close to each other, so that one electrode of the chip capacitor and the coil are connected, excluding the chip capacitor. A diagonal soldering method for LC composite parts in which only the wiring part and the terminal of the coil bobbin are dipped in solder. 2. A holding means for holding the coil bobbin between the ends of two chuck pins whose axes are in the longitudinal direction of the coil bobbin, and rotating and tilting the LC composite component by rotating at least one of the chuck pins about its axis. In order to simultaneously immerse only the terminals of the coil bobbin, the electrodes of the chip capacitor, and the wiring portion of the coil tilted by the rotation drive means in the molten solder, a solder bucket containing molten solder is placed. A diagonal soldering device for LC composite parts, which is equipped with a vertical movement means for vertical movement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57026931A JPS58143516A (en) | 1982-02-19 | 1982-02-19 | Method and device for obliquely soldering lc composite part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57026931A JPS58143516A (en) | 1982-02-19 | 1982-02-19 | Method and device for obliquely soldering lc composite part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58143516A JPS58143516A (en) | 1983-08-26 |
| JPH0213809B2 true JPH0213809B2 (en) | 1990-04-05 |
Family
ID=12206900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57026931A Granted JPS58143516A (en) | 1982-02-19 | 1982-02-19 | Method and device for obliquely soldering lc composite part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58143516A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3869065A1 (en) | 2020-02-21 | 2021-08-25 | Mitsubishi Heavy Industries Compressor Corporation | Rotary machine |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6163357A (en) * | 1984-09-04 | 1986-04-01 | Tamura Seisakusho Co Ltd | Soldering method and its device |
| US4841318A (en) * | 1984-11-14 | 1989-06-20 | Minolta Camera Kabushiki Kaisha | Camera system with mode selecting device |
-
1982
- 1982-02-19 JP JP57026931A patent/JPS58143516A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3869065A1 (en) | 2020-02-21 | 2021-08-25 | Mitsubishi Heavy Industries Compressor Corporation | Rotary machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58143516A (en) | 1983-08-26 |
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