JPS5618432A - Aligning device for semiconductor frame - Google Patents

Aligning device for semiconductor frame

Info

Publication number
JPS5618432A
JPS5618432A JP9407879A JP9407879A JPS5618432A JP S5618432 A JPS5618432 A JP S5618432A JP 9407879 A JP9407879 A JP 9407879A JP 9407879 A JP9407879 A JP 9407879A JP S5618432 A JPS5618432 A JP S5618432A
Authority
JP
Japan
Prior art keywords
frames
aligning
semiconductor
air
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9407879A
Other languages
Japanese (ja)
Other versions
JPS58183B2 (en
Inventor
Michio Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOWA SEIMITSU KOGYO KK
Original Assignee
TOWA SEIMITSU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOWA SEIMITSU KOGYO KK filed Critical TOWA SEIMITSU KOGYO KK
Priority to JP54094078A priority Critical patent/JPS58183B2/en
Publication of JPS5618432A publication Critical patent/JPS5618432A/en
Publication of JPS58183B2 publication Critical patent/JPS58183B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Air Transport Of Granular Materials (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To align smoothly and automatically the semiconductor frames without damage by a method wherein the semiconductor frames are transferred and aligned by air and are loaded in a loading frame. CONSTITUTION:The frame aligning device consists of a mechanism A to send semiconductor frames 1 upwardly, a mechanism B to push out the frames 1 toward the aligning side and an aligning mechanism C. Air introducing pathes 16 are provided in a base plate 18 of the aligning mechanism C, and air discharging holes are provided at the upper face of rail members 23 on the base plate. The semiconductor frames 1 are send out on the rails 23 by a pushing lever 13, a loading frame 32 is pushed up by the operation of air cylinders 20 and pins of respective loading projections are made to come in contact with respective semiconductor frames 1 to take it out from the aligning carrier mechanism C. By this way, as the frames 1 can be carried to the aligning position being in floating condition on the rail face, smooth and secure carrying and alignment can be performed without damaging the frames.
JP54094078A 1979-07-23 1979-07-23 Semiconductor frame alignment device Expired JPS58183B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54094078A JPS58183B2 (en) 1979-07-23 1979-07-23 Semiconductor frame alignment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54094078A JPS58183B2 (en) 1979-07-23 1979-07-23 Semiconductor frame alignment device

Publications (2)

Publication Number Publication Date
JPS5618432A true JPS5618432A (en) 1981-02-21
JPS58183B2 JPS58183B2 (en) 1983-01-05

Family

ID=14100446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54094078A Expired JPS58183B2 (en) 1979-07-23 1979-07-23 Semiconductor frame alignment device

Country Status (1)

Country Link
JP (1) JPS58183B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955025A (en) * 1982-09-22 1984-03-29 Fujitsu Ltd Conveyance of lead frame provided with base
JPS59169291U (en) * 1983-04-27 1984-11-13 吉貝機械金属株式会社 Brake lever device
CN104692087A (en) * 2015-01-16 2015-06-10 袁宇承 Discharging mechanism of pine needle machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955025A (en) * 1982-09-22 1984-03-29 Fujitsu Ltd Conveyance of lead frame provided with base
JPH0258774B2 (en) * 1982-09-22 1990-12-10 Fujitsu Ltd
JPS59169291U (en) * 1983-04-27 1984-11-13 吉貝機械金属株式会社 Brake lever device
JPS6340075Y2 (en) * 1983-04-27 1988-10-20
CN104692087A (en) * 2015-01-16 2015-06-10 袁宇承 Discharging mechanism of pine needle machine

Also Published As

Publication number Publication date
JPS58183B2 (en) 1983-01-05

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