JPS56172974U - - Google Patents

Info

Publication number
JPS56172974U
JPS56172974U JP1981071817U JP7181781U JPS56172974U JP S56172974 U JPS56172974 U JP S56172974U JP 1981071817 U JP1981071817 U JP 1981071817U JP 7181781 U JP7181781 U JP 7181781U JP S56172974 U JPS56172974 U JP S56172974U
Authority
JP
Japan
Prior art keywords
board
periphery
sealing
moisture wicking
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981071817U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS56172974U publication Critical patent/JPS56172974U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP1981071817U 1980-05-19 1981-05-18 Pending JPS56172974U (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/151,010 US4278707A (en) 1980-05-19 1980-05-19 Method for coating the edge of a printed circuit board to improve its moisture resistance

Publications (1)

Publication Number Publication Date
JPS56172974U true JPS56172974U (enExample) 1981-12-21

Family

ID=22536946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981071817U Pending JPS56172974U (enExample) 1980-05-19 1981-05-18

Country Status (2)

Country Link
US (1) US4278707A (enExample)
JP (1) JPS56172974U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946086A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板とその製造方法
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法
JPS59158580A (ja) * 1983-02-28 1984-09-08 イビデン株式会社 プリント配線基板の製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3380413D1 (en) * 1982-04-27 1989-09-21 Richardson Chemical Co Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
US4528243A (en) * 1984-10-16 1985-07-09 Dow Corning Corporation Method for surface treatment of polyorganosiloxane gel-filled containers to prevent bubble migration into said gel
JPS61139018A (ja) * 1984-12-10 1986-06-26 株式会社村田製作所 チツプ型電子部品の外部接続用電極を形成する方法
US4976814A (en) * 1988-07-18 1990-12-11 Motorola, Inc. Method of making a ceramic semiconductor package having crack arrestor patterns
US5255738A (en) * 1992-07-16 1993-10-26 E-Systems, Inc. Tapered thermal substrate for heat transfer applications and method for making same
US5460767A (en) * 1994-05-31 1995-10-24 Delco Electronics Corporation Hot melt masking materials
US6127038A (en) * 1997-12-11 2000-10-03 American Meter Company Printed circuit board coating and method
DE10052532C2 (de) * 2000-10-23 2002-11-14 Conducta Endress & Hauser Leiterplatte mit einer Eingangsschaltung zur Aufnahme und Verarbeitung eines elektrischen Signals sowie Verwendung der Leiterplatte
JP5115253B2 (ja) * 2008-03-10 2013-01-09 富士通株式会社 同軸コネクタ搭載回路基板及び同軸コネクタ搭載回路基板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170454A (ja) * 1974-12-16 1976-06-18 Suwa Seikosha Kk Shusekikaironojitsusohoho

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA664915A (en) * 1963-06-11 L. Greenman Norman Method of making a printed circuit
US4012307A (en) * 1975-12-05 1977-03-15 General Dynamics Corporation Method for conditioning drilled holes in multilayer wiring boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170454A (ja) * 1974-12-16 1976-06-18 Suwa Seikosha Kk Shusekikaironojitsusohoho

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946086A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板とその製造方法
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法
JPS59158580A (ja) * 1983-02-28 1984-09-08 イビデン株式会社 プリント配線基板の製造方法

Also Published As

Publication number Publication date
US4278707A (en) 1981-07-14

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