JPS56172974U - - Google Patents
Info
- Publication number
- JPS56172974U JPS56172974U JP1981071817U JP7181781U JPS56172974U JP S56172974 U JPS56172974 U JP S56172974U JP 1981071817 U JP1981071817 U JP 1981071817U JP 7181781 U JP7181781 U JP 7181781U JP S56172974 U JPS56172974 U JP S56172974U
- Authority
- JP
- Japan
- Prior art keywords
- board
- periphery
- sealing
- moisture wicking
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/151,010 US4278707A (en) | 1980-05-19 | 1980-05-19 | Method for coating the edge of a printed circuit board to improve its moisture resistance |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56172974U true JPS56172974U (ja) | 1981-12-21 |
Family
ID=22536946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981071817U Pending JPS56172974U (ja) | 1980-05-19 | 1981-05-18 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4278707A (ja) |
JP (1) | JPS56172974U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
JPS5967686A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板とその製造方法 |
JPS59158580A (ja) * | 1983-02-28 | 1984-09-08 | イビデン株式会社 | プリント配線基板の製造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3380413D1 (en) * | 1982-04-27 | 1989-09-21 | Richardson Chemical Co | Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
US4528243A (en) * | 1984-10-16 | 1985-07-09 | Dow Corning Corporation | Method for surface treatment of polyorganosiloxane gel-filled containers to prevent bubble migration into said gel |
JPS61139018A (ja) * | 1984-12-10 | 1986-06-26 | 株式会社村田製作所 | チツプ型電子部品の外部接続用電極を形成する方法 |
US4976814A (en) * | 1988-07-18 | 1990-12-11 | Motorola, Inc. | Method of making a ceramic semiconductor package having crack arrestor patterns |
US5255738A (en) * | 1992-07-16 | 1993-10-26 | E-Systems, Inc. | Tapered thermal substrate for heat transfer applications and method for making same |
US5460767A (en) * | 1994-05-31 | 1995-10-24 | Delco Electronics Corporation | Hot melt masking materials |
US6127038A (en) * | 1997-12-11 | 2000-10-03 | American Meter Company | Printed circuit board coating and method |
DE10052532C2 (de) * | 2000-10-23 | 2002-11-14 | Conducta Endress & Hauser | Leiterplatte mit einer Eingangsschaltung zur Aufnahme und Verarbeitung eines elektrischen Signals sowie Verwendung der Leiterplatte |
JP5115253B2 (ja) * | 2008-03-10 | 2013-01-09 | 富士通株式会社 | 同軸コネクタ搭載回路基板及び同軸コネクタ搭載回路基板の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5170454A (ja) * | 1974-12-16 | 1976-06-18 | Suwa Seikosha Kk | Shusekikaironojitsusohoho |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA664915A (en) * | 1963-06-11 | L. Greenman Norman | Method of making a printed circuit | |
US4012307A (en) * | 1975-12-05 | 1977-03-15 | General Dynamics Corporation | Method for conditioning drilled holes in multilayer wiring boards |
-
1980
- 1980-05-19 US US06/151,010 patent/US4278707A/en not_active Expired - Lifetime
-
1981
- 1981-05-18 JP JP1981071817U patent/JPS56172974U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5170454A (ja) * | 1974-12-16 | 1976-06-18 | Suwa Seikosha Kk | Shusekikaironojitsusohoho |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
JPS5967686A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板とその製造方法 |
JPS59158580A (ja) * | 1983-02-28 | 1984-09-08 | イビデン株式会社 | プリント配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US4278707A (en) | 1981-07-14 |
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