JPS56166376A - Ribbon for welding of pattern and its production - Google Patents

Ribbon for welding of pattern and its production

Info

Publication number
JPS56166376A
JPS56166376A JP6899380A JP6899380A JPS56166376A JP S56166376 A JPS56166376 A JP S56166376A JP 6899380 A JP6899380 A JP 6899380A JP 6899380 A JP6899380 A JP 6899380A JP S56166376 A JPS56166376 A JP S56166376A
Authority
JP
Japan
Prior art keywords
parts
resist
substrate
patterns
ribbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6899380A
Other languages
Japanese (ja)
Inventor
Keiji Kurosawa
Haruo Kawamata
Mitsuo Yamashita
Kyuzo Mitsui
Takayoshi Imura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6899380A priority Critical patent/JPS56166376A/en
Publication of JPS56166376A publication Critical patent/JPS56166376A/en
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To produce a titled ribbon which can restore patterns of arbitrary shapes by removing the photosensitive resist in the parts corresponding to the patterns of a substrate having a conductor surface, and carrying out electroplating on said parts then peeling the plated parts.
CONSTITUTION: Photosensitive resist 6 is deposited on a substrate 5 such as an insulation plate of which the surface is made conductive or a metallic plate deposited with dissimilar metal. Thence, a mask drawn with required patterns is placed on the resist 6, and is exposed and developed, whereby the resist 6 of the parts 7, 7' corresponding to the patterns are removed,thereby exposing the substrate 5 in said parts 7, 7'. Next, plating is carried out in order of, for example, noble metal 8, Cu or Ni9 and noble metal 10, to allow plating metals to deposit in the parts 7, 7'. Thence, the resist 6 is removed and if the parts 8W10 are peeled from the substrate 5, welded ribbons 11, 11' of arbitrary shapes such as curved and bent shapes are obtained.
COPYRIGHT: (C)1981,JPO&Japio
JP6899380A 1980-05-26 1980-05-26 Ribbon for welding of pattern and its production Pending JPS56166376A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6899380A JPS56166376A (en) 1980-05-26 1980-05-26 Ribbon for welding of pattern and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6899380A JPS56166376A (en) 1980-05-26 1980-05-26 Ribbon for welding of pattern and its production

Publications (1)

Publication Number Publication Date
JPS56166376A true JPS56166376A (en) 1981-12-21

Family

ID=13389686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6899380A Pending JPS56166376A (en) 1980-05-26 1980-05-26 Ribbon for welding of pattern and its production

Country Status (1)

Country Link
JP (1) JPS56166376A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101041464B1 (en) * 2009-05-08 2011-06-16 국방과학연구소 Method for fabricating ribbon for semiconductor device package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101041464B1 (en) * 2009-05-08 2011-06-16 국방과학연구소 Method for fabricating ribbon for semiconductor device package

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