JPS56162851A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56162851A
JPS56162851A JP6751580A JP6751580A JPS56162851A JP S56162851 A JPS56162851 A JP S56162851A JP 6751580 A JP6751580 A JP 6751580A JP 6751580 A JP6751580 A JP 6751580A JP S56162851 A JPS56162851 A JP S56162851A
Authority
JP
Japan
Prior art keywords
wafer
grooves
shaped strip
projections
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6751580A
Other languages
Japanese (ja)
Inventor
Hisao Kumabe
Hirobumi Namisaki
Wataru Suzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6751580A priority Critical patent/JPS56162851A/en
Publication of JPS56162851A publication Critical patent/JPS56162851A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

PURPOSE:To divide a semiconductor crystalline wafer into chips without occurrence of cracks or the like by applying a load to the wafer by forming V-shaped strip grooves at a predetermined interval on the wafer and fixing a cutting plate provided with wedge-shaped strip projections at the same interval as the grooves onto the wafer. CONSTITUTION:V-shaped strip grooves 15 are formed on one crystalline surface 11 of a semiconductor crystalline wafer 14, and V-shaped strip grooves 16 are so formed as to perpendicularly cross the grooves 15 on the other crystalline surface 12. The wafer 14 is disposed on an elastic plate 18 such as a rubber plate or the like, and a cutting plate 19 having wedge projections 20 is superposed on the wafer. At this time, it is adjusted that the position of the projections 20 is matched to that of the grooves 16. When a cylindrical weight applying member 21 is then pressed onto the plate 19 while being rotated, the wafer 14 is cleaved by the grooves 16 and is divided into individual chips. Since unreasonable load is not applied to the wafer, it can suppress the occurrence of cracks or the like at the wafer.
JP6751580A 1980-05-19 1980-05-19 Manufacture of semiconductor device Pending JPS56162851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6751580A JPS56162851A (en) 1980-05-19 1980-05-19 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6751580A JPS56162851A (en) 1980-05-19 1980-05-19 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56162851A true JPS56162851A (en) 1981-12-15

Family

ID=13347190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6751580A Pending JPS56162851A (en) 1980-05-19 1980-05-19 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56162851A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233948A (en) * 1988-07-22 1990-02-05 Matsushita Electric Ind Co Ltd Manufacture of optical semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233948A (en) * 1988-07-22 1990-02-05 Matsushita Electric Ind Co Ltd Manufacture of optical semiconductor device

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