JPS56162851A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56162851A JPS56162851A JP6751580A JP6751580A JPS56162851A JP S56162851 A JPS56162851 A JP S56162851A JP 6751580 A JP6751580 A JP 6751580A JP 6751580 A JP6751580 A JP 6751580A JP S56162851 A JPS56162851 A JP S56162851A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- grooves
- shaped strip
- projections
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Abstract
PURPOSE:To divide a semiconductor crystalline wafer into chips without occurrence of cracks or the like by applying a load to the wafer by forming V-shaped strip grooves at a predetermined interval on the wafer and fixing a cutting plate provided with wedge-shaped strip projections at the same interval as the grooves onto the wafer. CONSTITUTION:V-shaped strip grooves 15 are formed on one crystalline surface 11 of a semiconductor crystalline wafer 14, and V-shaped strip grooves 16 are so formed as to perpendicularly cross the grooves 15 on the other crystalline surface 12. The wafer 14 is disposed on an elastic plate 18 such as a rubber plate or the like, and a cutting plate 19 having wedge projections 20 is superposed on the wafer. At this time, it is adjusted that the position of the projections 20 is matched to that of the grooves 16. When a cylindrical weight applying member 21 is then pressed onto the plate 19 while being rotated, the wafer 14 is cleaved by the grooves 16 and is divided into individual chips. Since unreasonable load is not applied to the wafer, it can suppress the occurrence of cracks or the like at the wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6751580A JPS56162851A (en) | 1980-05-19 | 1980-05-19 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6751580A JPS56162851A (en) | 1980-05-19 | 1980-05-19 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56162851A true JPS56162851A (en) | 1981-12-15 |
Family
ID=13347190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6751580A Pending JPS56162851A (en) | 1980-05-19 | 1980-05-19 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56162851A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0233948A (en) * | 1988-07-22 | 1990-02-05 | Matsushita Electric Ind Co Ltd | Manufacture of optical semiconductor device |
-
1980
- 1980-05-19 JP JP6751580A patent/JPS56162851A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0233948A (en) * | 1988-07-22 | 1990-02-05 | Matsushita Electric Ind Co Ltd | Manufacture of optical semiconductor device |
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