JPS56162846A - Ic gang bonding device - Google Patents

Ic gang bonding device

Info

Publication number
JPS56162846A
JPS56162846A JP6685580A JP6685580A JPS56162846A JP S56162846 A JPS56162846 A JP S56162846A JP 6685580 A JP6685580 A JP 6685580A JP 6685580 A JP6685580 A JP 6685580A JP S56162846 A JPS56162846 A JP S56162846A
Authority
JP
Japan
Prior art keywords
tape
chip
twisted
pitch
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6685580A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0130299B2 (enExample
Inventor
Yoshiaki Tanaka
Shunichi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP6685580A priority Critical patent/JPS56162846A/ja
Publication of JPS56162846A publication Critical patent/JPS56162846A/ja
Publication of JPH0130299B2 publication Critical patent/JPH0130299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
JP6685580A 1980-05-20 1980-05-20 Ic gang bonding device Granted JPS56162846A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6685580A JPS56162846A (en) 1980-05-20 1980-05-20 Ic gang bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6685580A JPS56162846A (en) 1980-05-20 1980-05-20 Ic gang bonding device

Publications (2)

Publication Number Publication Date
JPS56162846A true JPS56162846A (en) 1981-12-15
JPH0130299B2 JPH0130299B2 (enExample) 1989-06-19

Family

ID=13327876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6685580A Granted JPS56162846A (en) 1980-05-20 1980-05-20 Ic gang bonding device

Country Status (1)

Country Link
JP (1) JPS56162846A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142534A (ja) * 1982-02-19 1983-08-24 Nec Corp フイルムキヤリアボンデイング装置
JPS58165335A (ja) * 1982-03-26 1983-09-30 Nec Corp テ−プキヤリア方式による半導体装置の製造方法及びその製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142534A (ja) * 1982-02-19 1983-08-24 Nec Corp フイルムキヤリアボンデイング装置
JPS58165335A (ja) * 1982-03-26 1983-09-30 Nec Corp テ−プキヤリア方式による半導体装置の製造方法及びその製造装置

Also Published As

Publication number Publication date
JPH0130299B2 (enExample) 1989-06-19

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