JPS56161457A - Heat-resisting resin composition - Google Patents

Heat-resisting resin composition

Info

Publication number
JPS56161457A
JPS56161457A JP6552980A JP6552980A JPS56161457A JP S56161457 A JPS56161457 A JP S56161457A JP 6552980 A JP6552980 A JP 6552980A JP 6552980 A JP6552980 A JP 6552980A JP S56161457 A JPS56161457 A JP S56161457A
Authority
JP
Japan
Prior art keywords
varnish
heat
resisting
bismaleimide
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6552980A
Other languages
English (en)
Inventor
Kazuya Yonezawa
Kosaku Nagano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP6552980A priority Critical patent/JPS56161457A/ja
Priority to US06/263,512 priority patent/US4362826A/en
Priority to DE8181103754T priority patent/DE3173232D1/de
Priority to EP81103754A priority patent/EP0040415B1/en
Publication of JPS56161457A publication Critical patent/JPS56161457A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
JP6552980A 1980-05-17 1980-05-17 Heat-resisting resin composition Pending JPS56161457A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP6552980A JPS56161457A (en) 1980-05-17 1980-05-17 Heat-resisting resin composition
US06/263,512 US4362826A (en) 1980-05-17 1981-05-14 Heat-resistant resin composition
DE8181103754T DE3173232D1 (en) 1980-05-17 1981-05-15 Heat-resistant resin compositions and their use for coating metal substrates
EP81103754A EP0040415B1 (en) 1980-05-17 1981-05-15 Heat-resistant resin compositions and their use for coating metal substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6552980A JPS56161457A (en) 1980-05-17 1980-05-17 Heat-resisting resin composition

Publications (1)

Publication Number Publication Date
JPS56161457A true JPS56161457A (en) 1981-12-11

Family

ID=13289624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6552980A Pending JPS56161457A (en) 1980-05-17 1980-05-17 Heat-resisting resin composition

Country Status (4)

Country Link
US (1) US4362826A (ja)
EP (1) EP0040415B1 (ja)
JP (1) JPS56161457A (ja)
DE (1) DE3173232D1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62232475A (ja) * 1986-04-02 1987-10-12 Hitachi Chem Co Ltd 熱硬化性接着フイルム

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985509A (en) * 1985-04-18 1991-01-15 Hitachi, Ltd. Heat curable resin composition
US4883858A (en) * 1987-08-25 1989-11-28 Nippon Oil And Fats Co., Ltd. Thermosetting resin from amine terminated amic acid and bis-maleimide
US4987207A (en) * 1988-05-17 1991-01-22 Mitsui Toatsu Chemicals, Inc. Thermosetting resin compositions
EP0367884B1 (en) * 1988-10-06 1993-04-28 Sekisui Kagaku Kogyo Kabushiki Kaisha An undercoat composition
EP0363524A1 (en) * 1988-10-14 1990-04-18 Hercules Incorporated Bismaleimide compositions containing high glass transition temperature and soluble reactive oligomers and composites prepared therefrom
JPH02289648A (ja) * 1989-02-23 1990-11-29 Nippon Oil & Fats Co Ltd 摺動部材
US5089346A (en) * 1989-03-23 1992-02-18 Hitachi Chemical Company, Ltd. Heat resistant adhesive composition and bonding method using the same
JPH03179026A (ja) * 1989-09-01 1991-08-05 Nitto Denko Corp 熱硬化性樹脂組成物、樹脂シート、プリプレグ及び積層板
US5200474A (en) * 1990-08-22 1993-04-06 Industrial Technology Research Institute Polyimide adhesive composition including barbituric acid modifier
EP1420048A3 (en) * 2002-11-14 2005-09-21 Mitsui Chemicals, Inc. Metal laminate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US317634A (en) * 1885-05-12 William m
JPS4977956A (ja) * 1972-11-02 1974-07-26

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179634A (en) * 1962-01-26 1965-04-20 Du Pont Aromatic polyimides and the process for preparing them
FR2237931A1 (en) * 1973-07-19 1975-02-14 Rhone Poulenc Sa Thermosetting moulding compsn. contg. carbon and glass fibres - and resin from bismaleimide and biprimary amine
FR2288767A1 (fr) * 1974-10-21 1976-05-21 Rhone Poulenc Ind Compositions thermodurcissables a base de bis-imide polyurethanne
JPS531298A (en) * 1976-06-25 1978-01-09 Toshiba Chem Corp Thermosettig resin compositions
JPS5342241A (en) * 1976-09-29 1978-04-17 Nitto Electric Ind Co Ltd Stabilization of water-soluble compositions
JPS5614554A (en) * 1979-07-13 1981-02-12 Kanegafuchi Chem Ind Co Ltd Heat resistant resin composition
JPS5667326A (en) * 1979-11-05 1981-06-06 Hitachi Ltd Imide type compound and production thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US317634A (en) * 1885-05-12 William m
JPS4977956A (ja) * 1972-11-02 1974-07-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62232475A (ja) * 1986-04-02 1987-10-12 Hitachi Chem Co Ltd 熱硬化性接着フイルム
JPH0346512B2 (ja) * 1986-04-02 1991-07-16 Hitachi Chemical Co Ltd

Also Published As

Publication number Publication date
DE3173232D1 (en) 1986-01-30
EP0040415A3 (en) 1982-02-17
US4362826A (en) 1982-12-07
EP0040415A2 (en) 1981-11-25
EP0040415B1 (en) 1985-12-18

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