JPS56158457A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56158457A
JPS56158457A JP6176480A JP6176480A JPS56158457A JP S56158457 A JPS56158457 A JP S56158457A JP 6176480 A JP6176480 A JP 6176480A JP 6176480 A JP6176480 A JP 6176480A JP S56158457 A JPS56158457 A JP S56158457A
Authority
JP
Japan
Prior art keywords
sealing
cap
semiconductor device
package
cost
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6176480A
Other languages
Japanese (ja)
Inventor
Masufuku Tajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6176480A priority Critical patent/JPS56158457A/en
Publication of JPS56158457A publication Critical patent/JPS56158457A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To contrive to reduce the cost of the semiconductor device by a method wherein a metal for sealing of a cap is applied only to the part necessary for the sealing. CONSTITUTION:A gold plating 11 for sealing of a package is provided in a ring shape on the part of the lower face of the cap 10 corresponding to a metalized layer 8. When the package 1 is to be sealed by adhering thermally the cap 10 interposing a solder material 9 between them, favorable sealing performance can be obtained with a little using quantity of Au to reduce the cost.
JP6176480A 1980-05-12 1980-05-12 Semiconductor device Pending JPS56158457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6176480A JPS56158457A (en) 1980-05-12 1980-05-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6176480A JPS56158457A (en) 1980-05-12 1980-05-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56158457A true JPS56158457A (en) 1981-12-07

Family

ID=13180516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6176480A Pending JPS56158457A (en) 1980-05-12 1980-05-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56158457A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136555A (en) * 1982-09-29 1984-08-06 アム−エア・リミッテッド・パ−トナ−シップ Ionizing device for internal combustion engine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136555A (en) * 1982-09-29 1984-08-06 アム−エア・リミッテッド・パ−トナ−シップ Ionizing device for internal combustion engine
JPS6346265B2 (en) * 1982-09-29 1988-09-14 Amuuea Ltd Paatonaashitsupu

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