JPS56155593A - Steel foil for printed circuit and method of manufacturing same - Google Patents
Steel foil for printed circuit and method of manufacturing sameInfo
- Publication number
- JPS56155593A JPS56155593A JP4519780A JP4519780A JPS56155593A JP S56155593 A JPS56155593 A JP S56155593A JP 4519780 A JP4519780 A JP 4519780A JP 4519780 A JP4519780 A JP 4519780A JP S56155593 A JPS56155593 A JP S56155593A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- steel foil
- manufacturing same
- foil
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/923—Physical dimension
- Y10S428/924—Composite
- Y10S428/926—Thickness of individual layer specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4519780A JPS56155593A (en) | 1980-04-08 | 1980-04-08 | Steel foil for printed circuit and method of manufacturing same |
GB8108521A GB2073779B (en) | 1980-04-08 | 1981-03-18 | Nickel coated copper foil for a rinted circuit |
DE19813112217 DE3112217A1 (de) | 1980-04-08 | 1981-03-27 | Kupferfolie fuer eine gedruckte schaltung und verfahren zu ihrer herstellung |
US06/476,248 US4483906A (en) | 1980-04-08 | 1983-03-18 | Copper foil for a printed circuit and a method for the production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4519780A JPS56155593A (en) | 1980-04-08 | 1980-04-08 | Steel foil for printed circuit and method of manufacturing same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56155593A true JPS56155593A (en) | 1981-12-01 |
JPS6255714B2 JPS6255714B2 (ja) | 1987-11-20 |
Family
ID=12712538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4519780A Granted JPS56155593A (en) | 1980-04-08 | 1980-04-08 | Steel foil for printed circuit and method of manufacturing same |
Country Status (4)
Country | Link |
---|---|
US (1) | US4483906A (ja) |
JP (1) | JPS56155593A (ja) |
DE (1) | DE3112217A1 (ja) |
GB (1) | GB2073779B (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
JPS6113688A (ja) * | 1984-06-28 | 1986-01-21 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその製造方法 |
US4647315A (en) * | 1985-07-01 | 1987-03-03 | Olin Corporation | Copper stainproofing technique |
US5057193A (en) * | 1989-04-05 | 1991-10-15 | Olin Corporation | Anti-tarnish treatment of metal foil |
US4961828A (en) * | 1989-04-05 | 1990-10-09 | Olin Corporation | Treatment of metal foil |
US4952285A (en) * | 1989-04-14 | 1990-08-28 | Olin Corporation | Anti-tarnish treatment of metal foil |
US5022968A (en) * | 1990-09-20 | 1991-06-11 | Olin Corporation | Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil |
US5098796A (en) * | 1989-10-13 | 1992-03-24 | Olin Corporation | Chromium-zinc anti-tarnish coating on copper foil |
US5230932A (en) * | 1989-10-13 | 1993-07-27 | Olin Corporation | Chromium-zinc anti-tarnish coating for copper foil |
US5250363A (en) * | 1989-10-13 | 1993-10-05 | Olin Corporation | Chromium-zinc anti-tarnish coating for copper foil having a dark color |
US5071520A (en) * | 1989-10-30 | 1991-12-10 | Olin Corporation | Method of treating metal foil to improve peel strength |
US5164235A (en) * | 1990-03-06 | 1992-11-17 | Olin Corporation | Anti-tarnish treatment of metal foil |
TW208110B (ja) * | 1990-06-08 | 1993-06-21 | Furukawa Circuit Foil Kk | |
WO1992000405A1 (en) * | 1990-07-02 | 1992-01-09 | Olin Corporation | Rinsing of copper foil after anti-tarnish treatment |
US5275891A (en) * | 1990-10-04 | 1994-01-04 | Hitachi Metals, Ltd. | R-TM-B permanent magnet member having improved corrosion resistance and method of producing same |
JPH0787270B2 (ja) * | 1992-02-19 | 1995-09-20 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
US5274195A (en) * | 1992-06-02 | 1993-12-28 | Advanced Circuit Technology, Inc. | Laminated conductive material, multiple conductor cables and methods of manufacturing such cables |
US5332486A (en) * | 1993-01-29 | 1994-07-26 | Gould Electronics Inc. | Anti-oxidant coatings for copper foils |
TW317575B (ja) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
US6106907A (en) | 1996-06-25 | 2000-08-22 | Canon Kabushiki Kaisha | Electrode plate, liquid crystal device and production thereof |
US6610417B2 (en) * | 2001-10-04 | 2003-08-26 | Oak-Mitsui, Inc. | Nickel coated copper as electrodes for embedded passive devices |
DE10361360A1 (de) * | 2003-12-18 | 2005-07-14 | Varta Microbattery Gmbh | Galvanisches Element |
US7190016B2 (en) * | 2004-10-08 | 2007-03-13 | Rohm And Haas Electronic Materials Llc | Capacitor structure |
WO2020050331A1 (ja) * | 2018-09-06 | 2020-03-12 | 日立金属株式会社 | ニッケル被覆銅箔およびその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3585010A (en) * | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
US3981691A (en) * | 1974-07-01 | 1976-09-21 | Minnesota Mining And Manufacturing Company | Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers |
JPS5491766A (en) * | 1977-12-22 | 1979-07-20 | Gould Inc | Printed circuit board easy to errode and method of producing same |
JPS6255713A (ja) * | 1985-09-04 | 1987-03-11 | Mitsubishi Electric Corp | ゲ−ト自動制御装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
US3781596A (en) * | 1972-07-07 | 1973-12-25 | R Galli | Semiconductor chip carriers and strips thereof |
GB1468294A (en) * | 1974-09-18 | 1977-03-23 | Yates Industries | Electrolytic copper stainproofing process |
US4088544A (en) * | 1976-04-19 | 1978-05-09 | Hutkin Irving J | Composite and method for making thin copper foil |
US4260449A (en) * | 1977-12-22 | 1981-04-07 | Gould Inc. | Method of forming a printed circuit |
US4311768A (en) * | 1977-12-22 | 1982-01-19 | Gould Inc. | Printed circuit board having mutually etchable copper and nickel layers |
JPS5912039B2 (ja) * | 1979-01-31 | 1984-03-19 | 古河サ−キツトフオイル株式会社 | 印刷回路用銅箔およびその製造方法 |
JPS55145396A (en) * | 1979-04-27 | 1980-11-12 | Furukawa Circuit Foil | Copper foil for printed circuit and method of fabricating same |
US4386139A (en) * | 1980-10-31 | 1983-05-31 | Furukawa Circuit Foil Co., Ltd. | Copper foil for a printed circuit and a method for the production thereof |
-
1980
- 1980-04-08 JP JP4519780A patent/JPS56155593A/ja active Granted
-
1981
- 1981-03-18 GB GB8108521A patent/GB2073779B/en not_active Expired
- 1981-03-27 DE DE19813112217 patent/DE3112217A1/de active Granted
-
1983
- 1983-03-18 US US06/476,248 patent/US4483906A/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3585010A (en) * | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
US3981691A (en) * | 1974-07-01 | 1976-09-21 | Minnesota Mining And Manufacturing Company | Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers |
JPS5491766A (en) * | 1977-12-22 | 1979-07-20 | Gould Inc | Printed circuit board easy to errode and method of producing same |
JPS6255713A (ja) * | 1985-09-04 | 1987-03-11 | Mitsubishi Electric Corp | ゲ−ト自動制御装置 |
Also Published As
Publication number | Publication date |
---|---|
GB2073779B (en) | 1983-10-05 |
GB2073779A (en) | 1981-10-21 |
JPS6255714B2 (ja) | 1987-11-20 |
DE3112217A1 (de) | 1982-02-04 |
DE3112217C2 (ja) | 1988-11-10 |
US4483906A (en) | 1984-11-20 |
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