JPS56155581A - Manufacture of piezoelectric element or the like - Google Patents
Manufacture of piezoelectric element or the likeInfo
- Publication number
- JPS56155581A JPS56155581A JP5925680A JP5925680A JPS56155581A JP S56155581 A JPS56155581 A JP S56155581A JP 5925680 A JP5925680 A JP 5925680A JP 5925680 A JP5925680 A JP 5925680A JP S56155581 A JPS56155581 A JP S56155581A
- Authority
- JP
- Japan
- Prior art keywords
- plane portion
- machinable
- machinable material
- piezoelectric element
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
Abstract
PURPOSE:To make the material for a piezoelectric element extremely thin by bonding a machinable material to a plane portion of said material, and grinding the plane portion while supporting the machinable material. CONSTITUTION:A thin-plate material 1 such as ceramic is bonded to the end surface of a machinable material 2 such as hardened synthetic resin, and one surface of the material 1 is ground into a plane to form a plane portion 3. One surface of a machinable material 4 such as hardened synthetic resin is bonded 5 to the plane portion 3. Then, the machinable material 4 is chucked, and the machinable material 2 is cut off. The machinable material 4 has a tubular shape, whose center line a and the plane portion 3 cross each other at right angle. A grinder 7 provided on a horizontal rotating shaft 6 perpendicular to the center line is vertically moved to grind the other end surface of the material 1 into an extremely thin shape. Then, the bonding agent 5 is dissolved in order to separate the thin plate 1'. By said method, the material 1 can be made extremely thin, and errors are diffused. Accordingly, the degree of accuracy is increased, and the piezoelectric element can be miniaturized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5925680A JPS56155581A (en) | 1980-05-01 | 1980-05-01 | Manufacture of piezoelectric element or the like |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5925680A JPS56155581A (en) | 1980-05-01 | 1980-05-01 | Manufacture of piezoelectric element or the like |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56155581A true JPS56155581A (en) | 1981-12-01 |
Family
ID=13108110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5925680A Pending JPS56155581A (en) | 1980-05-01 | 1980-05-01 | Manufacture of piezoelectric element or the like |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56155581A (en) |
-
1980
- 1980-05-01 JP JP5925680A patent/JPS56155581A/en active Pending
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