JPS5275171A - Method of mirror-surface cutting of semiconductor - Google Patents
Method of mirror-surface cutting of semiconductorInfo
- Publication number
- JPS5275171A JPS5275171A JP15058375A JP15058375A JPS5275171A JP S5275171 A JPS5275171 A JP S5275171A JP 15058375 A JP15058375 A JP 15058375A JP 15058375 A JP15058375 A JP 15058375A JP S5275171 A JPS5275171 A JP S5275171A
- Authority
- JP
- Japan
- Prior art keywords
- mirror
- semiconductor
- surface cutting
- bonding
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
PURPOSE: To prevent the decrease in the cutting quality of grindstone and finish cut faces to a mirror surface by bonding several sheets of semiconductor materials using a bonding agent prepared by mixing fine powder of a suitable hardness to a given bonding resin, then cutting the bonded material.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15058375A JPS5275171A (en) | 1975-12-19 | 1975-12-19 | Method of mirror-surface cutting of semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15058375A JPS5275171A (en) | 1975-12-19 | 1975-12-19 | Method of mirror-surface cutting of semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5275171A true JPS5275171A (en) | 1977-06-23 |
Family
ID=15500047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15058375A Pending JPS5275171A (en) | 1975-12-19 | 1975-12-19 | Method of mirror-surface cutting of semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5275171A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4826064A (en) * | 1971-08-06 | 1973-04-05 |
-
1975
- 1975-12-19 JP JP15058375A patent/JPS5275171A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4826064A (en) * | 1971-08-06 | 1973-04-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES8306445A1 (en) | Apparatus and method for the grinding of material. | |
JPS5796780A (en) | Abrasive | |
JPS5275171A (en) | Method of mirror-surface cutting of semiconductor | |
JPS5429188A (en) | Abrasive wheel for grinding machine and method of producing the same | |
JPS5274990A (en) | Nonspherical polishing lap tool | |
JPS5414155A (en) | Manufacture for semiconductor device | |
JPS5214295A (en) | Grinding finishing apparatus | |
JPS5315691A (en) | Method of making resinoid grinding stone | |
JPS5327367A (en) | Polisher | |
JPS52143592A (en) | Composite grinder | |
JPS5214359A (en) | Process for sealing of the semiconductor and lead-frame used in this method | |
JPS5477390A (en) | Resinoid grindstone ingredients | |
JPS5741171A (en) | Grindstone for grinding and cutting | |
JPS5248890A (en) | Method of fabricating electrolytic grinding grindstone | |
JPS5380889A (en) | Cutting and grinding tool | |
JPS55122265A (en) | Production of thin film magnetic head | |
JPS5248889A (en) | Electrolytic grinding grindstone | |
JPS5314491A (en) | Apparatus for grinding double surfaces | |
JPS56114668A (en) | Adjustable reamer | |
JPS5598831A (en) | Manufacture of semiconductor wafer | |
JPS55131745A (en) | Knife for use in supermicrotome | |
JPS5259394A (en) | Method of surfacing mirror polishing dish | |
JPS5664438A (en) | Adhesive for fixing holding plate of semiconductor monocrystalline ingot | |
JPS51145995A (en) | Grindstone for grinding | |
JPS51143981A (en) | Method of simultaneously truing and dressing grindstone |