JPS561526A - Substrate holding jig for substrate treatment - Google Patents

Substrate holding jig for substrate treatment

Info

Publication number
JPS561526A
JPS561526A JP7612879A JP7612879A JPS561526A JP S561526 A JPS561526 A JP S561526A JP 7612879 A JP7612879 A JP 7612879A JP 7612879 A JP7612879 A JP 7612879A JP S561526 A JPS561526 A JP S561526A
Authority
JP
Japan
Prior art keywords
substrate holding
holding plate
metal
substrate
carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7612879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6339093B2 (enExample
Inventor
Atsuo Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7612879A priority Critical patent/JPS561526A/ja
Publication of JPS561526A publication Critical patent/JPS561526A/ja
Publication of JPS6339093B2 publication Critical patent/JPS6339093B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
JP7612879A 1979-06-15 1979-06-15 Substrate holding jig for substrate treatment Granted JPS561526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7612879A JPS561526A (en) 1979-06-15 1979-06-15 Substrate holding jig for substrate treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7612879A JPS561526A (en) 1979-06-15 1979-06-15 Substrate holding jig for substrate treatment

Publications (2)

Publication Number Publication Date
JPS561526A true JPS561526A (en) 1981-01-09
JPS6339093B2 JPS6339093B2 (enExample) 1988-08-03

Family

ID=13596287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7612879A Granted JPS561526A (en) 1979-06-15 1979-06-15 Substrate holding jig for substrate treatment

Country Status (1)

Country Link
JP (1) JPS561526A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5230923A (en) * 1975-09-04 1977-03-09 Osaka Gas Co Ltd Burner with total use-hour indicator
JPS622240U (enExample) * 1985-06-20 1987-01-08

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0491583U (enExample) * 1990-12-26 1992-08-10
JPH0491584U (enExample) * 1990-12-26 1992-08-10
KR102581508B1 (ko) * 2021-08-27 2023-09-22 주식회사 디오 디지털 오버덴쳐의 제조방법
KR102590346B1 (ko) * 2021-08-27 2023-10-18 주식회사 디오 디지털 오버덴쳐의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378765A (en) * 1976-12-23 1978-07-12 Toshiba Corp Semiconductor wafer heating stand for gas phase growth
JPS5464460U (enExample) * 1977-10-14 1979-05-08
JPS5475661U (enExample) * 1977-11-09 1979-05-29

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378765A (en) * 1976-12-23 1978-07-12 Toshiba Corp Semiconductor wafer heating stand for gas phase growth
JPS5464460U (enExample) * 1977-10-14 1979-05-08
JPS5475661U (enExample) * 1977-11-09 1979-05-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5230923A (en) * 1975-09-04 1977-03-09 Osaka Gas Co Ltd Burner with total use-hour indicator
JPS622240U (enExample) * 1985-06-20 1987-01-08

Also Published As

Publication number Publication date
JPS6339093B2 (enExample) 1988-08-03

Similar Documents

Publication Publication Date Title
IT8019613A0 (it) Processo per depositare tracciati metallici su un substrato ceramico senza l'uso di maschere.
JPS561526A (en) Substrate holding jig for substrate treatment
BR8402693A (pt) Processo de preparacao e uso de eletrodos
JPS51119686A (en) A method for forming a film on the metal surface
JPS55134173A (en) Etching method for aluminum or aluminum base alloy
JPS5437581A (en) Wafer etching device
JPS51140199A (en) Crystal working process
JPS52151555A (en) Manufacture of luminous screen
JPS5339873A (en) Etching method of silicon semiconductor substrate containing gold
JPS5785978A (en) Etching jig
JPS53101975A (en) Treating method of semiconductor substrates
JPS545386A (en) Surface processor for wafer
Morgan Comment on" Reaction of Si sub 3 N sub 4 with Al sub 2 O sub 3 and Y sub 2 O sub 3" and" Silicon vttrium oxynitrides."
JPS5647571A (en) Etching liquid for mo
JPS547868A (en) Manufacture for beam lead type semiconductor device
JPS52122479A (en) Etching solution of silicon
Tomandl Statistical Theory of Particle Growth in Crystalline Ceramics Without Liquid Phase
JPS5253296A (en) Manufacturig process of resistant body for variable resistor
Mokrushin et al. Annihilation of Positrons in Single Crystals of III-V Semiconductors
FR2388056A1 (fr) Procede pour revetir les appareils en platine ou en alliage a base de platine afin d'assurer leur protection lors de leur utilisation a haute temperature
JPS5424236A (en) Etching solution and minute working process
JPS6417432A (en) Etching method for semiconductor wafer
JPS5230790A (en) Anode made of ceramics for electrolysis
JPS5488767A (en) Manufacture for semiconductor element
KUZNETSOV Utilization of the method of continuation with respect to the length of the integration segment for calculating circular corrugated plates