JPS5615057A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5615057A
JPS5615057A JP9124779A JP9124779A JPS5615057A JP S5615057 A JPS5615057 A JP S5615057A JP 9124779 A JP9124779 A JP 9124779A JP 9124779 A JP9124779 A JP 9124779A JP S5615057 A JPS5615057 A JP S5615057A
Authority
JP
Japan
Prior art keywords
lead
lead frame
lead wires
frame
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9124779A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9124779A priority Critical patent/JPS5615057A/en
Publication of JPS5615057A publication Critical patent/JPS5615057A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable machining and fabrication of an inner lead frame accurately by forming a connector having a curved opening at the ends of the lead wires of the lead frame and removing the connector substantially simultaneously upon formation of the lead frame. CONSTITUTION:Inner leads 9 and the ends of the lead 9 are retained and machined to form bumps 13 at the ends of the lead wires of inner lead wires 8 having polyimide supporting frame 12, and a connecting cushion 10 is finally removed. Accordingly, even if external force is loaded at the time of holding and stamping for machining, the inner lead wire 9 may neither be bent nor displaced the position due to the provision of the cushion 10 thereat.
JP9124779A 1979-07-18 1979-07-18 Lead frame Pending JPS5615057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9124779A JPS5615057A (en) 1979-07-18 1979-07-18 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9124779A JPS5615057A (en) 1979-07-18 1979-07-18 Lead frame

Publications (1)

Publication Number Publication Date
JPS5615057A true JPS5615057A (en) 1981-02-13

Family

ID=14021084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9124779A Pending JPS5615057A (en) 1979-07-18 1979-07-18 Lead frame

Country Status (1)

Country Link
JP (1) JPS5615057A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245950A (en) * 1986-12-15 1988-10-13 エスジーエス―トムソン　マイクロエレクトロニクス　インク． Method of bending lead of lead frame extending in curve shape on the same plane into step shape when semiconductor chip is packaged

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245950A (en) * 1986-12-15 1988-10-13 エスジーエス―トムソン　マイクロエレクトロニクス　インク． Method of bending lead of lead frame extending in curve shape on the same plane into step shape when semiconductor chip is packaged

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