JPS56147437A - Electron beam exposure method - Google Patents
Electron beam exposure methodInfo
- Publication number
- JPS56147437A JPS56147437A JP5066280A JP5066280A JPS56147437A JP S56147437 A JPS56147437 A JP S56147437A JP 5066280 A JP5066280 A JP 5066280A JP 5066280 A JP5066280 A JP 5066280A JP S56147437 A JPS56147437 A JP S56147437A
- Authority
- JP
- Japan
- Prior art keywords
- deflected
- electron beam
- pattern
- mark
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Electron Beam Exposure (AREA)
Abstract
PURPOSE:To accurately lithograph an oblique pattern by a method wherein microbeams near two reference points of the second diaphragm are used to scan the mark on the surface of a sample in order to obtain the displacement amounts of the projection positions of both the reference points, and the diflection amount is corrected according to said amounts. CONSTITUTION:An alignment mark 35 on a sample 12 is scanned by using the electron beam 36 which is deflected 7 so that the overlap of the image 14 of the first diaphragm 5 and the aperture 15 of the second diaphragm is located near a reference point K. The electrons reflected from end portions 37 are detected 32, and peak signals 34 are sent to a CPU21 to obtain the central coordinates of the mark. Then, the electron beam 36 is deflected 7 again to form a microbeam near the second reference point K' in order to scan the mark 35, and the central coordinates thereof are obtained. Differences DELTAx and DELTAy between both the central coordinates are obtained in the CPU21 and stored 27. When an oblique pattern is lithographed, the pattern is read out 24 to deflect 7 the electron beam, which is moreover deflected 11 by adding 29 the read-out position- designating signals to the deflection correcting amounts DELTAx and DELTAy so that the beam having a section of the oblique pattern is deflected to a given position. Thereby, the position of the oblique pattern is designated by using the reference point K of a rectangular pattern, so that lithography is accurately performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5066280A JPS56147437A (en) | 1980-04-17 | 1980-04-17 | Electron beam exposure method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5066280A JPS56147437A (en) | 1980-04-17 | 1980-04-17 | Electron beam exposure method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56147437A true JPS56147437A (en) | 1981-11-16 |
JPS6232613B2 JPS6232613B2 (en) | 1987-07-15 |
Family
ID=12865158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5066280A Granted JPS56147437A (en) | 1980-04-17 | 1980-04-17 | Electron beam exposure method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56147437A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58121625A (en) * | 1981-12-28 | 1983-07-20 | Fujitsu Ltd | Electron-beam exposure device |
JPS5961134A (en) * | 1982-09-30 | 1984-04-07 | Toshiba Corp | Charged beam exposing device |
JPS62172724A (en) * | 1986-01-27 | 1987-07-29 | Toshiba Corp | Charged beam exposure method |
-
1980
- 1980-04-17 JP JP5066280A patent/JPS56147437A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58121625A (en) * | 1981-12-28 | 1983-07-20 | Fujitsu Ltd | Electron-beam exposure device |
JPH047088B2 (en) * | 1981-12-28 | 1992-02-07 | Fujitsu Ltd | |
JPS5961134A (en) * | 1982-09-30 | 1984-04-07 | Toshiba Corp | Charged beam exposing device |
JPS62172724A (en) * | 1986-01-27 | 1987-07-29 | Toshiba Corp | Charged beam exposure method |
Also Published As
Publication number | Publication date |
---|---|
JPS6232613B2 (en) | 1987-07-15 |
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