JPS56137354A - Mask forming method - Google Patents
Mask forming methodInfo
- Publication number
- JPS56137354A JPS56137354A JP4008380A JP4008380A JPS56137354A JP S56137354 A JPS56137354 A JP S56137354A JP 4008380 A JP4008380 A JP 4008380A JP 4008380 A JP4008380 A JP 4008380A JP S56137354 A JPS56137354 A JP S56137354A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- etching
- mask
- hydrophobic resist
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Weting (AREA)
Abstract
PURPOSE:To extremely lower the defect density of a mask by spraying an etching soln. on the central part of a mask substrate while rotating the substrate to perform perfect etching when a highly hydrophobic resist is used. CONSTITUTION:When the metallic thin film of a mask substrate is etched in a process of coating the substrate with a highly hydrophobic resist such as polymethylmethacrylate (PMMA) and forming a pattern, the substrate is held by suction with a vacuum chuck and rotated at 400r.p.m. speed, and an etching soln. is sprayed on the central part of the substrate from a spray nozzle to etch the chromium/chromium oxide film. The etching soln. contains ceric ammonium nitrate as a principal component. This method is applicable to other hydrophobic resist and to etching with X-rays or ultraviolet rays.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4008380A JPS56137354A (en) | 1980-03-28 | 1980-03-28 | Mask forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4008380A JPS56137354A (en) | 1980-03-28 | 1980-03-28 | Mask forming method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56137354A true JPS56137354A (en) | 1981-10-27 |
Family
ID=12570999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4008380A Pending JPS56137354A (en) | 1980-03-28 | 1980-03-28 | Mask forming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56137354A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS598340A (en) * | 1982-07-06 | 1984-01-17 | Mitsubishi Electric Corp | Forming method for protective film of semiconductor device |
WO1998033847A1 (en) * | 1997-01-31 | 1998-08-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | How to modify substrate polymer or copolymer surfaces containing methacrylate |
-
1980
- 1980-03-28 JP JP4008380A patent/JPS56137354A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS598340A (en) * | 1982-07-06 | 1984-01-17 | Mitsubishi Electric Corp | Forming method for protective film of semiconductor device |
WO1998033847A1 (en) * | 1997-01-31 | 1998-08-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | How to modify substrate polymer or copolymer surfaces containing methacrylate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4410611A (en) | Hard and adherent layers from organic resin coatings | |
EP0095209A3 (en) | Method of forming a resist mask resistant to plasma etching | |
JPS5669835A (en) | Method for forming thin film pattern | |
JPS56137354A (en) | Mask forming method | |
JPS556844A (en) | Method of formating wiring pattern | |
JPS52119172A (en) | Forming method of fine pattern | |
JPS5469090A (en) | Manufacture of semiconductor device | |
JPS54116883A (en) | Electron beam exposure method | |
JPS57155539A (en) | Mask | |
JPS56146137A (en) | Formation of mask | |
JPS55143560A (en) | Manufacture of photomask | |
JPS58152241A (en) | Manufacture of high-precision mask | |
JPS53112671A (en) | Forming method for pattern | |
JPS5748731A (en) | Manufacture of mask | |
JPS5741638A (en) | Photomask for electron beam | |
JPS5635774A (en) | Dry etching method | |
JPS563679A (en) | Formation of metallic pattern | |
JPS56130750A (en) | Manufacture of mask | |
JPS5699342A (en) | Manufacture of photomask | |
JPS56133738A (en) | Forming method for pattern of photomask | |
JPS55128830A (en) | Method of working photoresist film | |
JPS57173943A (en) | Manufacture of photo mask | |
JPS5743425A (en) | Forming method for fine pattern | |
JPS54135639A (en) | Forming method for gold pattern | |
JPS57135950A (en) | Preparation of photomask |