JPS56133855A - Sealing method for electronic parts - Google Patents
Sealing method for electronic partsInfo
- Publication number
- JPS56133855A JPS56133855A JP3576980A JP3576980A JPS56133855A JP S56133855 A JPS56133855 A JP S56133855A JP 3576980 A JP3576980 A JP 3576980A JP 3576980 A JP3576980 A JP 3576980A JP S56133855 A JPS56133855 A JP S56133855A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- electronic parts
- reliability
- stability
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3576980A JPS56133855A (en) | 1980-03-22 | 1980-03-22 | Sealing method for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3576980A JPS56133855A (en) | 1980-03-22 | 1980-03-22 | Sealing method for electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56133855A true JPS56133855A (en) | 1981-10-20 |
Family
ID=12451066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3576980A Pending JPS56133855A (en) | 1980-03-22 | 1980-03-22 | Sealing method for electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56133855A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948942A (ja) * | 1982-09-14 | 1984-03-21 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS63241061A (ja) * | 1986-11-13 | 1988-10-06 | Sunstar Giken Kk | エポキシ樹脂組成物 |
-
1980
- 1980-03-22 JP JP3576980A patent/JPS56133855A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948942A (ja) * | 1982-09-14 | 1984-03-21 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH0520447B2 (ja) * | 1982-09-14 | 1993-03-19 | Tokyo Shibaura Electric Co | |
JPS63241061A (ja) * | 1986-11-13 | 1988-10-06 | Sunstar Giken Kk | エポキシ樹脂組成物 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Kaas et al. | The interaction of alkoxy silane coupling agents with silica surfaces | |
CN103666250B (zh) | 一种有机硅披覆胶及其制备方法 | |
EP0389138A3 (en) | Method of making organosiloxane resins | |
DE2301547A1 (de) | Organosilicon-stoffzusammensetzung | |
CA1265260A (en) | Method of sealing electric and electronic parts | |
ES8301149A1 (es) | Un procedimiento para la produccion de un articulo recubierto por imprimacion. | |
KR950008433A (ko) | Si-O 함유 피복물을 형성시키는 방법 | |
JPS5717153A (en) | Sealing method of electronic parts | |
JPS564625A (en) | Epoxy resin composition | |
KR930007997A (ko) | 폴리히드릭 페놀 및 그것을 사용하여 수득한 에폭시 수지 | |
DE4117471C2 (de) | Silikonkautschuk-Zusammensetzungen und deren gehärtete Produkte | |
CN103205234A (zh) | 一种低粘度中性有机硅胶及其应用 | |
US3946427A (en) | Semiconductor device | |
JPS56133855A (en) | Sealing method for electronic parts | |
KR880000123A (ko) | 광물성 멤브레인의 제조방법 | |
ES8301259A1 (es) | Un metodo para adherir caucho de silicona a un substrato. | |
KR850006701A (ko) | 충진된 축합 중합체 복합물용 오르가노실리콘/옥시란 첨가제 | |
ATE119289T1 (de) | Verfahren zum binden einer analytempfindlichen farbstoffverbindung an ein durch einen zusatz härtbares silikon und verwendung zur herstellung einer sensoreinrichtung. | |
JPS5767635A (en) | Dyed article having improved abrasion resistance | |
JPS6460658A (en) | Primer composition for electric and electronic component | |
KR880001753A (ko) | 아크릴 중합체 함유 열경화성 조성물 및 이 조성물로 피복된 성형용기재의 제조방법 | |
JPS53140973A (en) | Forming method of semiconductor insulation film | |
JPS55145730A (en) | Curable resin composition | |
KR900018283A (ko) | 열경화성 수지 조성물 | |
JPS6070729A (ja) | 半導体装置 |