JPS56130956A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56130956A
JPS56130956A JP3445080A JP3445080A JPS56130956A JP S56130956 A JPS56130956 A JP S56130956A JP 3445080 A JP3445080 A JP 3445080A JP 3445080 A JP3445080 A JP 3445080A JP S56130956 A JPS56130956 A JP S56130956A
Authority
JP
Japan
Prior art keywords
container
hole
semiconductor
semiconductor element
lifetime
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3445080A
Other languages
Japanese (ja)
Inventor
Takashi Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3445080A priority Critical patent/JPS56130956A/en
Publication of JPS56130956A publication Critical patent/JPS56130956A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To effectively cool a semiconductor element and to improve the lifetime and the operating characteristics thereof by communicating fluid adapted for cooling from intake and exhaust holes formed at a cover plate on the top of a semiconductor container into a cavity making contact with the element in the container. CONSTITUTION:An intake hole 6 and an exhaust hole 7 are opened at a part of a cover plate 5 formed on the upper surface of a ceramic semiconductor container. Gas or liquid adapted for cooling is introduced from the hole 6 into a semiconductor element container 8 and discharged from the hole 7. Since the semiconductor element 3 can be effectively cooled in this manner, it can prolong the lifetime of the element and improve the operating characteristics thereof.
JP3445080A 1980-03-18 1980-03-18 Semiconductor device Pending JPS56130956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3445080A JPS56130956A (en) 1980-03-18 1980-03-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3445080A JPS56130956A (en) 1980-03-18 1980-03-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56130956A true JPS56130956A (en) 1981-10-14

Family

ID=12414579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3445080A Pending JPS56130956A (en) 1980-03-18 1980-03-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56130956A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297069A (en) * 2003-03-27 2004-10-21 Stmicroelectronics Inc Systems and methods for direct convection cooling of exposed integrated circuit die surfaces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297069A (en) * 2003-03-27 2004-10-21 Stmicroelectronics Inc Systems and methods for direct convection cooling of exposed integrated circuit die surfaces

Similar Documents

Publication Publication Date Title
FR2316742B1 (en)
KR970003435A (en) Removal ring to control edge deposition in substrate processing equipment
SE7409228L (en) CARAVOR DEVICE.
JPS56130956A (en) Semiconductor device
JPS6416611A (en) Dicing device for semiconductive wafer
JPS6489498A (en) Liquid cooling of large computer and liquid cooling device therefor
DE3683315D1 (en) REFRIGERATION CHAMBER FOR PROCESSING OBJECTS FOR MICROSCOPIC OR ELECTRON MICROSCOPIC EXAMINATIONS.
JPS56130952A (en) Semiconductor device
JPS5524476A (en) Laser oscillator
JPS5745974A (en) Pressure contact type semiconductor device
JPS5752150A (en) Semiconductor device with element forming region surrounded by porous silicon oxide
JPS5761710A (en) Melt spinning apparatus
JPS5791346A (en) Manufacture of cylinder head of internal combustion engine and products thereof
JPS5559754A (en) Semiconductor device
FR2300896A1 (en) Two-stroke IC engine - has inclined scavenging channels above piston top edge in lower dead centre position
JPS59103091U (en) Cooling tower blow device
JPS56159595A (en) Compressor for cooling cycle
JPS6428953A (en) Semiconductor device
JPS5599751A (en) Power amplifier
JPS5651849A (en) Cooling device for integrated circuit
DK1211469T3 (en) Device for freezing, freezing or cooling
JPS5657257A (en) Thin nonaqueous-electrolyte battery
SU1266558A1 (en) Contact device
JPS56126064A (en) Vacuum pressure casting device
JPS5285640A (en) Carbreator device with temperature accommodating device