JPS56122151A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56122151A
JPS56122151A JP2503080A JP2503080A JPS56122151A JP S56122151 A JPS56122151 A JP S56122151A JP 2503080 A JP2503080 A JP 2503080A JP 2503080 A JP2503080 A JP 2503080A JP S56122151 A JPS56122151 A JP S56122151A
Authority
JP
Japan
Prior art keywords
container
evaporator
interior
semiconductor element
hollow pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2503080A
Other languages
English (en)
Other versions
JPS6131622B2 (ja
Inventor
Haruo Tetsuno
Shogo Itano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2503080A priority Critical patent/JPS56122151A/ja
Publication of JPS56122151A publication Critical patent/JPS56122151A/ja
Publication of JPS6131622B2 publication Critical patent/JPS6131622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2503080A 1980-02-28 1980-02-28 Semiconductor device Granted JPS56122151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2503080A JPS56122151A (en) 1980-02-28 1980-02-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2503080A JPS56122151A (en) 1980-02-28 1980-02-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56122151A true JPS56122151A (en) 1981-09-25
JPS6131622B2 JPS6131622B2 (ja) 1986-07-21

Family

ID=12154506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2503080A Granted JPS56122151A (en) 1980-02-28 1980-02-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56122151A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326237C (zh) * 2003-09-04 2007-07-11 珍通科技股份有限公司 圆管型散热器结构

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62168216U (ja) * 1986-04-16 1987-10-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326237C (zh) * 2003-09-04 2007-07-11 珍通科技股份有限公司 圆管型散热器结构

Also Published As

Publication number Publication date
JPS6131622B2 (ja) 1986-07-21

Similar Documents

Publication Publication Date Title
US3609992A (en) Hermetically sealed box for maintaining a semiconductor radiation detector at a very low temperature
US4036291A (en) Cooling device for electric device
US3609206A (en) Evaporative cooling system for insulated bus
US2383735A (en) Rectifier
US4739633A (en) Room temperature to cryogenic electrical interface
GB768103A (en) Improvements in or relating to semiconductor devices
JPS56122151A (en) Semiconductor device
JPS6452330A (en) Vacuum heat insulating superconductor employing getter device
JPS5749787A (en) Boiling cooler
US4809133A (en) Low temperature monolithic chip
JPS56122152A (en) Semiconductor device
US2448407A (en) Condenser
US2292081A (en) Electric discharge device
JPS56122150A (en) Semiconductor device
JPS56122153A (en) Semiconductor device
JPS56130955A (en) Cooler for semiconductor element
RU2013898C1 (ru) Устройство для отвода сопла от высокопотенциальных теплонагруженных узлов радиоэлектронной аппаратуры
JPH0364950A (ja) 電気絶縁ヒートパイプ
JPS6490027A (en) Transportation vessel device
GB834000A (en) Improvements in or relating to semi-conductor devices
SU1643858A1 (ru) Устройство дл подачи жидкого хладагента
JPS56107505A (en) Cooling structure for high tention apparatus
JPS5568057A (en) Electron gun
JPS56150882A (en) Superconductive magnet current supplying device
JPH045244B2 (ja)