JPS56116697A - Method of forming conductor layer on multilayer circuit board - Google Patents
Method of forming conductor layer on multilayer circuit boardInfo
- Publication number
- JPS56116697A JPS56116697A JP2016480A JP2016480A JPS56116697A JP S56116697 A JPS56116697 A JP S56116697A JP 2016480 A JP2016480 A JP 2016480A JP 2016480 A JP2016480 A JP 2016480A JP S56116697 A JPS56116697 A JP S56116697A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductor layer
- multilayer circuit
- forming conductor
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016480A JPS56116697A (en) | 1980-02-19 | 1980-02-19 | Method of forming conductor layer on multilayer circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016480A JPS56116697A (en) | 1980-02-19 | 1980-02-19 | Method of forming conductor layer on multilayer circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56116697A true JPS56116697A (en) | 1981-09-12 |
JPS6155797B2 JPS6155797B2 (es) | 1986-11-29 |
Family
ID=12019509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016480A Granted JPS56116697A (en) | 1980-02-19 | 1980-02-19 | Method of forming conductor layer on multilayer circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56116697A (es) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58119694A (ja) * | 1982-01-12 | 1983-07-16 | 株式会社日立製作所 | 配線基板の製造方法 |
JPS58121698A (ja) * | 1982-01-12 | 1983-07-20 | 株式会社日立製作所 | 多層配線基板 |
JPS58128797A (ja) * | 1982-01-27 | 1983-08-01 | 日本電気株式会社 | 多層セラミツク基板の製造方法 |
US6428942B1 (en) | 1999-10-28 | 2002-08-06 | Fujitsu Limited | Multilayer circuit structure build up method |
US6869750B2 (en) | 1999-10-28 | 2005-03-22 | Fujitsu Limited | Structure and method for forming a multilayered structure |
US6882045B2 (en) | 1999-10-28 | 2005-04-19 | Thomas J. Massingill | Multi-chip module and method for forming and method for deplating defective capacitors |
-
1980
- 1980-02-19 JP JP2016480A patent/JPS56116697A/ja active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58119694A (ja) * | 1982-01-12 | 1983-07-16 | 株式会社日立製作所 | 配線基板の製造方法 |
JPS58121698A (ja) * | 1982-01-12 | 1983-07-20 | 株式会社日立製作所 | 多層配線基板 |
JPH0451998B2 (es) * | 1982-01-12 | 1992-08-20 | Hitachi Ltd | |
JPH0544199B2 (es) * | 1982-01-12 | 1993-07-05 | Hitachi Ltd | |
JPS58128797A (ja) * | 1982-01-27 | 1983-08-01 | 日本電気株式会社 | 多層セラミツク基板の製造方法 |
US6428942B1 (en) | 1999-10-28 | 2002-08-06 | Fujitsu Limited | Multilayer circuit structure build up method |
US6869750B2 (en) | 1999-10-28 | 2005-03-22 | Fujitsu Limited | Structure and method for forming a multilayered structure |
US6882045B2 (en) | 1999-10-28 | 2005-04-19 | Thomas J. Massingill | Multi-chip module and method for forming and method for deplating defective capacitors |
Also Published As
Publication number | Publication date |
---|---|
JPS6155797B2 (es) | 1986-11-29 |
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