JPS56114378A - Semiconductor pressure sensor - Google Patents
Semiconductor pressure sensorInfo
- Publication number
- JPS56114378A JPS56114378A JP1668380A JP1668380A JPS56114378A JP S56114378 A JPS56114378 A JP S56114378A JP 1668380 A JP1668380 A JP 1668380A JP 1668380 A JP1668380 A JP 1668380A JP S56114378 A JPS56114378 A JP S56114378A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- notched groove
- pressure
- thin
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
Abstract
PURPOSE:To improve a measurement precision by reducing nonlinear characteristics of a pressure and produced stress by method wherein a circular notched groove is formed on the surface in the center of a semiconductor element substrate forming the pressure sensor and an annular notched groove surrounding the circular notched groove at an interval is formed on the reverse at the peripheral edge respectively. CONSTITUTION:The circular notched groove 11 is perforated on the surface in the center 9 of the semiconductor substrate 7 and the annular notched groove 12 is formed on the reverse in the middle part 8 located on the outer periphery of the groove 11 with a thin vertical part 10 of the substrate 7 being inserted between the grooves 11 and 12. Thus, a thin part 8a parallel to the substrate 7 is grown on the surface of the middle part 8 and burried with distortion resistance element 6, and the peripheral edge 13 is left as in the thickness of the substrate 7. Whereby force horizontally produced due to the transformation of the thin part 8a and thin vertical part 10 caused when the substrate 7 is applied with a pressure on the surface is remarkably decreased, the nonlinear characteristic of distortion to the pressure being reduced and the measurement precision is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1668380A JPS56114378A (en) | 1980-02-15 | 1980-02-15 | Semiconductor pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1668380A JPS56114378A (en) | 1980-02-15 | 1980-02-15 | Semiconductor pressure sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56114378A true JPS56114378A (en) | 1981-09-08 |
JPS646546B2 JPS646546B2 (en) | 1989-02-03 |
Family
ID=11923108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1668380A Granted JPS56114378A (en) | 1980-02-15 | 1980-02-15 | Semiconductor pressure sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56114378A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0115074A2 (en) * | 1982-12-29 | 1984-08-08 | Fuji Electric Co. Ltd. | Differential pressure measuring device |
JPS6310575A (en) * | 1986-07-01 | 1988-01-18 | Nippon Denso Co Ltd | Semiconductor strain detector |
EP0276889A2 (en) * | 1987-01-28 | 1988-08-03 | Philips Patentverwaltung GmbH | Pressure transducer for static pressure charges with a silicon body |
US9952112B2 (en) | 2014-05-26 | 2018-04-24 | Kabushiki Kaisha Toshiba | Pressure sensor, microphone, ultrasonic sensor, blood pressure sensor, and touch panel |
-
1980
- 1980-02-15 JP JP1668380A patent/JPS56114378A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0115074A2 (en) * | 1982-12-29 | 1984-08-08 | Fuji Electric Co. Ltd. | Differential pressure measuring device |
JPS6310575A (en) * | 1986-07-01 | 1988-01-18 | Nippon Denso Co Ltd | Semiconductor strain detector |
EP0276889A2 (en) * | 1987-01-28 | 1988-08-03 | Philips Patentverwaltung GmbH | Pressure transducer for static pressure charges with a silicon body |
US9952112B2 (en) | 2014-05-26 | 2018-04-24 | Kabushiki Kaisha Toshiba | Pressure sensor, microphone, ultrasonic sensor, blood pressure sensor, and touch panel |
Also Published As
Publication number | Publication date |
---|---|
JPS646546B2 (en) | 1989-02-03 |
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