JPS56112496A - Plating method - Google Patents
Plating methodInfo
- Publication number
- JPS56112496A JPS56112496A JP1333180A JP1333180A JPS56112496A JP S56112496 A JPS56112496 A JP S56112496A JP 1333180 A JP1333180 A JP 1333180A JP 1333180 A JP1333180 A JP 1333180A JP S56112496 A JPS56112496 A JP S56112496A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- plating
- solder
- soln
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating By Spraying Or Casting (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1333180A JPS56112496A (en) | 1980-02-05 | 1980-02-05 | Plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1333180A JPS56112496A (en) | 1980-02-05 | 1980-02-05 | Plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56112496A true JPS56112496A (en) | 1981-09-04 |
JPS5761834B2 JPS5761834B2 (ja) | 1982-12-27 |
Family
ID=11830150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1333180A Granted JPS56112496A (en) | 1980-02-05 | 1980-02-05 | Plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56112496A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175754A (ja) * | 1983-03-26 | 1984-10-04 | Furukawa Electric Co Ltd:The | 集積回路用リ−ドフレ−ム |
US5248527A (en) * | 1991-03-01 | 1993-09-28 | C. Uyemura And Company, Limited | Process for electroless plating tin, lead or tin-lead alloy |
JP2001288577A (ja) * | 2000-01-28 | 2001-10-19 | Km Europ Metal Ag | 銅合金よりなる中空建材の内部表面に錫層を設ける方法 |
CN109735890A (zh) * | 2018-12-27 | 2019-05-10 | 大连理工大学 | 一种纳米TiO2-Sn微凸点的制备方法 |
-
1980
- 1980-02-05 JP JP1333180A patent/JPS56112496A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175754A (ja) * | 1983-03-26 | 1984-10-04 | Furukawa Electric Co Ltd:The | 集積回路用リ−ドフレ−ム |
US5248527A (en) * | 1991-03-01 | 1993-09-28 | C. Uyemura And Company, Limited | Process for electroless plating tin, lead or tin-lead alloy |
JP2001288577A (ja) * | 2000-01-28 | 2001-10-19 | Km Europ Metal Ag | 銅合金よりなる中空建材の内部表面に錫層を設ける方法 |
CN109735890A (zh) * | 2018-12-27 | 2019-05-10 | 大连理工大学 | 一种纳米TiO2-Sn微凸点的制备方法 |
CN109735890B (zh) * | 2018-12-27 | 2020-10-13 | 大连理工大学 | 一种纳米TiO2-Sn微凸点的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5761834B2 (ja) | 1982-12-27 |
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