JPS56108893A - Gilding solution - Google Patents

Gilding solution

Info

Publication number
JPS56108893A
JPS56108893A JP1112780A JP1112780A JPS56108893A JP S56108893 A JPS56108893 A JP S56108893A JP 1112780 A JP1112780 A JP 1112780A JP 1112780 A JP1112780 A JP 1112780A JP S56108893 A JPS56108893 A JP S56108893A
Authority
JP
Japan
Prior art keywords
soln
frame
gilding
plating
goldpotassium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1112780A
Other languages
Japanese (ja)
Inventor
Katsuhiko Hayashi
Shunji Fujie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP1112780A priority Critical patent/JPS56108893A/en
Publication of JPS56108893A publication Critical patent/JPS56108893A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To provide gilding soln. which capable of gild only a part to which electricity is applied, by composing said soln. of prescribed ratios of goldpotassium cyanide, potassium primary phosphate, potassium secondary phosphate, phosphoric acid, and KOH, and by adjusting the pH to weak acidity.
CONSTITUTION: This gilding soln. is composed of 1.0W2.5g/l goldpotassium cyanide, 10W50g/l KH2PO4, 10W50g/l K2HPO4, ≥5g/l H3PO4, 5g/l KOH and is adjusted to 4.5W6.5pH. "Kovar " plate is etched to form a lead frame 7, and metallic outer ring 1 is fixed by sealing to the lead 2, 3 of each set airtightly and insulatingly with interposition of borosilicate glass 4. Then the whole plating apparatus is immersed into an electroless Ni-plating soln. so as to form plated layer of prescribed thickness on the surfaces of the outer ring 1 and the frame 7. Subsequently, gilded layer is formed only on the frame part 7 by plating by applying electricity only to the frame 7.
COPYRIGHT: (C)1981,JPO&Japio
JP1112780A 1980-01-31 1980-01-31 Gilding solution Pending JPS56108893A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1112780A JPS56108893A (en) 1980-01-31 1980-01-31 Gilding solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1112780A JPS56108893A (en) 1980-01-31 1980-01-31 Gilding solution

Publications (1)

Publication Number Publication Date
JPS56108893A true JPS56108893A (en) 1981-08-28

Family

ID=11769347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1112780A Pending JPS56108893A (en) 1980-01-31 1980-01-31 Gilding solution

Country Status (1)

Country Link
JP (1) JPS56108893A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113737265A (en) * 2021-11-04 2021-12-03 新恒汇电子股份有限公司 Flexible carrier band coating quality control system and control method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113737265A (en) * 2021-11-04 2021-12-03 新恒汇电子股份有限公司 Flexible carrier band coating quality control system and control method
CN113737265B (en) * 2021-11-04 2022-02-08 新恒汇电子股份有限公司 Flexible carrier band coating quality control system and control method

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