JPS56105655A - Soldering method of lead wire - Google Patents

Soldering method of lead wire

Info

Publication number
JPS56105655A
JPS56105655A JP792380A JP792380A JPS56105655A JP S56105655 A JPS56105655 A JP S56105655A JP 792380 A JP792380 A JP 792380A JP 792380 A JP792380 A JP 792380A JP S56105655 A JPS56105655 A JP S56105655A
Authority
JP
Japan
Prior art keywords
lead wire
jig
layer
cleeping
nonelectrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP792380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258153B2 (enExample
Inventor
Masao Nishiyama
Masatoshi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP792380A priority Critical patent/JPS56105655A/ja
Publication of JPS56105655A publication Critical patent/JPS56105655A/ja
Publication of JPS6258153B2 publication Critical patent/JPS6258153B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/023—Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Chemically Coating (AREA)
JP792380A 1980-01-25 1980-01-25 Soldering method of lead wire Granted JPS56105655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP792380A JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP792380A JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Publications (2)

Publication Number Publication Date
JPS56105655A true JPS56105655A (en) 1981-08-22
JPS6258153B2 JPS6258153B2 (enExample) 1987-12-04

Family

ID=11679041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP792380A Granted JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Country Status (1)

Country Link
JP (1) JPS56105655A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62103258U (enExample) * 1985-12-19 1987-07-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62103258U (enExample) * 1985-12-19 1987-07-01

Also Published As

Publication number Publication date
JPS6258153B2 (enExample) 1987-12-04

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