JPS56104443A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56104443A
JPS56104443A JP581780A JP581780A JPS56104443A JP S56104443 A JPS56104443 A JP S56104443A JP 581780 A JP581780 A JP 581780A JP 581780 A JP581780 A JP 581780A JP S56104443 A JPS56104443 A JP S56104443A
Authority
JP
Japan
Prior art keywords
glass
groove
organic substance
softening
butylcarbitol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP581780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6161533B2 (enExample
Inventor
Masaaki Takahashi
Yutaka Misawa
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP581780A priority Critical patent/JPS56104443A/ja
Publication of JPS56104443A publication Critical patent/JPS56104443A/ja
Publication of JPS6161533B2 publication Critical patent/JPS6161533B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/134—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being in grooves in the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses

Landscapes

  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP581780A 1980-01-23 1980-01-23 Manufacture of semiconductor device Granted JPS56104443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP581780A JPS56104443A (en) 1980-01-23 1980-01-23 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP581780A JPS56104443A (en) 1980-01-23 1980-01-23 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56104443A true JPS56104443A (en) 1981-08-20
JPS6161533B2 JPS6161533B2 (enExample) 1986-12-26

Family

ID=11621629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP581780A Granted JPS56104443A (en) 1980-01-23 1980-01-23 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56104443A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61164045U (enExample) * 1986-03-20 1986-10-11
US5691237A (en) * 1993-09-20 1997-11-25 Fujitsu Limited Method for fabricating semiconductor device
US8662778B2 (en) 2006-12-21 2014-03-04 Diversey, Inc. Floor finish application assembly and method
EP2849213A4 (en) * 2012-05-08 2015-11-18 Shindengen Electric Mfg GLASS COMPOSITION FOR THE PROTECTION OF A SEMICONDUCTOR CONNECTION, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
EP2811511A4 (en) * 2012-01-31 2015-11-18 Shindengen Electric Mfg GLASS COMPOSITION FOR THE PROTECTION OF A SEMICONDUCTOR CONNECTION, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS491611A (enExample) * 1972-04-19 1974-01-09
JPS5128813A (ja) * 1974-09-04 1976-03-11 Hitachi Ltd Handotaisochihifukuyogarasu no seizohoho

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS491611A (enExample) * 1972-04-19 1974-01-09
JPS5128813A (ja) * 1974-09-04 1976-03-11 Hitachi Ltd Handotaisochihifukuyogarasu no seizohoho

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61164045U (enExample) * 1986-03-20 1986-10-11
US5691237A (en) * 1993-09-20 1997-11-25 Fujitsu Limited Method for fabricating semiconductor device
US8662778B2 (en) 2006-12-21 2014-03-04 Diversey, Inc. Floor finish application assembly and method
EP2811511A4 (en) * 2012-01-31 2015-11-18 Shindengen Electric Mfg GLASS COMPOSITION FOR THE PROTECTION OF A SEMICONDUCTOR CONNECTION, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
EP2849213A4 (en) * 2012-05-08 2015-11-18 Shindengen Electric Mfg GLASS COMPOSITION FOR THE PROTECTION OF A SEMICONDUCTOR CONNECTION, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Also Published As

Publication number Publication date
JPS6161533B2 (enExample) 1986-12-26

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