JPS56103231A - Foamable thermoplastic resin particle - Google Patents
Foamable thermoplastic resin particleInfo
- Publication number
- JPS56103231A JPS56103231A JP517580A JP517580A JPS56103231A JP S56103231 A JPS56103231 A JP S56103231A JP 517580 A JP517580 A JP 517580A JP 517580 A JP517580 A JP 517580A JP S56103231 A JPS56103231 A JP S56103231A
- Authority
- JP
- Japan
- Prior art keywords
- acid ester
- diallyl phthalate
- styrene
- foaming agent
- methacrylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE: To enable the stable and high expansion foaming under arbitrary conditions between atmospheric pressure and high pressure, by impregnating a foaming agent to particles prepared by polymerizing a styrene-type monomer, diallyl phthalate, and an acrylic acid ester or methacrylic acid ester.
CONSTITUTION: A foaming agent pref. a mixture of isobutane, etc. and other foaming agent, is impregnated in particles obtained by the polymerization of (A) a styrene-type monomer containing ≥50wt% of styrene, (B) diallyl phthalate, and (C) an acrylic acid ester or a methacrylic acid ester which gives a polymer having the second order transition point of ≤0°C when homopolymerized. The amount of the diallyl phthalate is 0.05W3wt% based on the raw materials of the resin as a whole, and that of the acrylic or methacrylic acid ester is 0.5W10wt%. The weight ratio of the diallyl phthalate to the (meth)acrylic acid ester is 1 to 3W10.
EFFECT: The composition does not shrink even after preliminary foaming.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP517580A JPS5858374B2 (en) | 1980-01-18 | 1980-01-18 | expandable thermoplastic resin particles |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP517580A JPS5858374B2 (en) | 1980-01-18 | 1980-01-18 | expandable thermoplastic resin particles |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56103231A true JPS56103231A (en) | 1981-08-18 |
JPS5858374B2 JPS5858374B2 (en) | 1983-12-24 |
Family
ID=11603896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP517580A Expired JPS5858374B2 (en) | 1980-01-18 | 1980-01-18 | expandable thermoplastic resin particles |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5858374B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013060500A (en) * | 2011-09-12 | 2013-04-04 | Sekisui Plastics Co Ltd | Polystyrenic resin particle, foamable resin particle, foamed particle, foam molding, and method for manufacturing these |
JP2015048356A (en) * | 2013-08-29 | 2015-03-16 | 積水化成品工業株式会社 | Foamable styrenic resin particle, foamed particle, foam molded body and manufacturing method of foamed particle |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3712904A4 (en) | 2017-11-13 | 2021-08-25 | Kyocera Corporation | Paste composition, semiconductor device, and electrical/electronic component |
-
1980
- 1980-01-18 JP JP517580A patent/JPS5858374B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013060500A (en) * | 2011-09-12 | 2013-04-04 | Sekisui Plastics Co Ltd | Polystyrenic resin particle, foamable resin particle, foamed particle, foam molding, and method for manufacturing these |
JP2015048356A (en) * | 2013-08-29 | 2015-03-16 | 積水化成品工業株式会社 | Foamable styrenic resin particle, foamed particle, foam molded body and manufacturing method of foamed particle |
Also Published As
Publication number | Publication date |
---|---|
JPS5858374B2 (en) | 1983-12-24 |
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