JPS56102589A - Acidic zinc plating bath - Google Patents
Acidic zinc plating bathInfo
- Publication number
- JPS56102589A JPS56102589A JP319580A JP319580A JPS56102589A JP S56102589 A JPS56102589 A JP S56102589A JP 319580 A JP319580 A JP 319580A JP 319580 A JP319580 A JP 319580A JP S56102589 A JPS56102589 A JP S56102589A
- Authority
- JP
- Japan
- Prior art keywords
- plating bath
- ethylene oxide
- oxide adduct
- zinc plating
- naphthol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To extend the applicable current range as well as prevent the deterioration of the plating characteristics (e.g. gloss) due to the elevation of the bath temp., by adding the reaction product of polyalkylene polyamine and epichlorohydrin, the ethylene oxide adduct of β-naphthol and others to the plating bath containing the each ion of Zn, NH4 and Cl.
CONSTITUTION: The reaction product of polyalkylene polyamine and epichlorohydrin, ethylene oxide adduct of β-naphthol, ethylene oxide adduct of fatty acid amine, the copolymer of polyoxypropylene and polyoxyethylene, and the aromatic carboxylic acid or its soluble salt to the zinc plating bath containing each ion of Zn, NH4 and Cl. In this case, a satisfactory result is attained by the synergetic effect of all above described additives; the use of a single member may be only slightly effective.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP319580A JPS56102589A (en) | 1980-01-16 | 1980-01-16 | Acidic zinc plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP319580A JPS56102589A (en) | 1980-01-16 | 1980-01-16 | Acidic zinc plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56102589A true JPS56102589A (en) | 1981-08-17 |
JPS5761830B2 JPS5761830B2 (en) | 1982-12-27 |
Family
ID=11550623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP319580A Granted JPS56102589A (en) | 1980-01-16 | 1980-01-16 | Acidic zinc plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56102589A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010055917A1 (en) | 2008-11-14 | 2010-05-20 | ユケン工業株式会社 | Acidic zinc plating bath |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6139546A (en) * | 1984-07-31 | 1986-02-25 | Toshiba Ceramics Co Ltd | Wafer mounting device and manufacture thereof |
-
1980
- 1980-01-16 JP JP319580A patent/JPS56102589A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010055917A1 (en) | 2008-11-14 | 2010-05-20 | ユケン工業株式会社 | Acidic zinc plating bath |
Also Published As
Publication number | Publication date |
---|---|
JPS5761830B2 (en) | 1982-12-27 |
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