JPS56101765A - Manufacture of semiconductor integrated circuit - Google Patents

Manufacture of semiconductor integrated circuit

Info

Publication number
JPS56101765A
JPS56101765A JP495980A JP495980A JPS56101765A JP S56101765 A JPS56101765 A JP S56101765A JP 495980 A JP495980 A JP 495980A JP 495980 A JP495980 A JP 495980A JP S56101765 A JPS56101765 A JP S56101765A
Authority
JP
Japan
Prior art keywords
silicon film
high resistance
resistance element
oxide
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP495980A
Other languages
Japanese (ja)
Inventor
Masashi Omori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP495980A priority Critical patent/JPS56101765A/en
Publication of JPS56101765A publication Critical patent/JPS56101765A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688Integrated circuits having a three-dimensional layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the density of integration in a MOSIC by the formation of a high resistance element composed of a silicon oxide film in the contact hole. CONSTITUTION:After a thick oxide silicon film 2, an oxide silicon film 3 as a gate insulating film and a polycrystalline silicon film 4 as a gate electrode are formed on a semiconductor substrate 1, a source drain region 6 is formed with the introduction of impurities. Next an oxide silicon film 7 is grown and formed in the gaseous phase. This sample is treated with heated sulphuric acid or nitric acid to use an oxide silicon film 9 formed on the exposed substrate as a high resistance element. In addition, a polycrystalline silicon film 10 is formed for the improvement of the stability of the element, which is followed by the formation of a wiring region 8, using a conductive material. By so doing, it is possible to provide a high resistance element in the contact hole, and this is tantamount to practically nullifying an area for the high resistance element.
JP495980A 1980-01-18 1980-01-18 Manufacture of semiconductor integrated circuit Pending JPS56101765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP495980A JPS56101765A (en) 1980-01-18 1980-01-18 Manufacture of semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP495980A JPS56101765A (en) 1980-01-18 1980-01-18 Manufacture of semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS56101765A true JPS56101765A (en) 1981-08-14

Family

ID=11598111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP495980A Pending JPS56101765A (en) 1980-01-18 1980-01-18 Manufacture of semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS56101765A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009534588A (en) * 2006-04-19 2009-09-24 タオ、ニン Double gear drive mechanism of reel unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009534588A (en) * 2006-04-19 2009-09-24 タオ、ニン Double gear drive mechanism of reel unit

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