JPS5583242A - Producing semiconductor device - Google Patents

Producing semiconductor device

Info

Publication number
JPS5583242A
JPS5583242A JP15642478A JP15642478A JPS5583242A JP S5583242 A JPS5583242 A JP S5583242A JP 15642478 A JP15642478 A JP 15642478A JP 15642478 A JP15642478 A JP 15642478A JP S5583242 A JPS5583242 A JP S5583242A
Authority
JP
Japan
Prior art keywords
tip
dumet
glass
electrodes
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15642478A
Other languages
Japanese (ja)
Inventor
Mitsusachi Matsuzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15642478A priority Critical patent/JPS5583242A/en
Publication of JPS5583242A publication Critical patent/JPS5583242A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide glass sealing on semiconductor tip compressed between magnetic electrodes by using permanent magnet.
CONSTITUTION: Semiconductor tip 14 is pinched by a pair of electrode leads 15, and Dumet electrodes 12 are covered with glass sleeves 13 by use of fixtures 21, 22. The assembly is sealed by glass sleeves heated to a temperature over its softening point. At the same time, the assembly is firmly fixed by pressure due to the difference between thermal expansions of glass sleeve and Dumet electrode. At this time carbon and permanent magnet are used as the upper 21 and lower 22 fixtures respectively, so that magnetic force acts on Dumet electrodes 12, and the tip 13 is compressed when sealed. Thus, good electrical and thermal connection between the tip 14 and lead 15 is provided.
COPYRIGHT: (C)1980,JPO&Japio
JP15642478A 1978-12-20 1978-12-20 Producing semiconductor device Pending JPS5583242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15642478A JPS5583242A (en) 1978-12-20 1978-12-20 Producing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15642478A JPS5583242A (en) 1978-12-20 1978-12-20 Producing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5583242A true JPS5583242A (en) 1980-06-23

Family

ID=15627438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15642478A Pending JPS5583242A (en) 1978-12-20 1978-12-20 Producing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5583242A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192085A (en) * 1981-05-21 1982-11-26 Toshiba Corp Solar cell and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192085A (en) * 1981-05-21 1982-11-26 Toshiba Corp Solar cell and manufacture thereof
JPS6216033B2 (en) * 1981-05-21 1987-04-10 Tokyo Shibaura Electric Co

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