JPS5580912A - Surface wave device - Google Patents

Surface wave device

Info

Publication number
JPS5580912A
JPS5580912A JP15369378A JP15369378A JPS5580912A JP S5580912 A JPS5580912 A JP S5580912A JP 15369378 A JP15369378 A JP 15369378A JP 15369378 A JP15369378 A JP 15369378A JP S5580912 A JPS5580912 A JP S5580912A
Authority
JP
Japan
Prior art keywords
surface wave
substrate
output
concavity
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15369378A
Other languages
Japanese (ja)
Inventor
Nobuki Yamaji
Fumio Miyashiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15369378A priority Critical patent/JPS5580912A/en
Publication of JPS5580912A publication Critical patent/JPS5580912A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To obtain a surface wave device which can set freely the shape of the surface wave transmission wave by using the flexible film type piezoelectric sheet for the substrate. CONSTITUTION:Using film-type flexible piezoelectric sheet 11 for the substrate, the metal is evaporated to mount inter-digital input and output electrodes 12 and 13 at the fixed positions. The surface wave excited from input electrode 12 connected to power source 14 propagates on the surface of substrate 11 as indicated by the arrow markings. In this case, substrate 11 is bent, and concavity 15 is provided at the center part of the substrate with a larger curvature sufficiently than the length of the surface wave. And if fluid 16 exists at concavity 16, the surface wave receives attenuation with no output produced substantially. While the surface wave reaches output electrode 13 with virtually no attenuation given. Thus the states of the prescribed value and 0 can be formed to the sensitive output. And the presence or absence can be monitored for the fluid by using, for example, the buzzer.
JP15369378A 1978-12-14 1978-12-14 Surface wave device Pending JPS5580912A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15369378A JPS5580912A (en) 1978-12-14 1978-12-14 Surface wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15369378A JPS5580912A (en) 1978-12-14 1978-12-14 Surface wave device

Publications (1)

Publication Number Publication Date
JPS5580912A true JPS5580912A (en) 1980-06-18

Family

ID=15568064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15369378A Pending JPS5580912A (en) 1978-12-14 1978-12-14 Surface wave device

Country Status (1)

Country Link
JP (1) JPS5580912A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132514A (en) * 1986-11-21 1988-06-04 Mitsubishi Petrochem Co Ltd Surface acoustic wave element using high polymer piezoelectric body
WO2016052679A1 (en) * 2014-09-30 2016-04-07 京セラ株式会社 Sensor device
WO2016068339A1 (en) * 2014-10-30 2016-05-06 京セラ株式会社 Sensor device
CN109039298A (en) * 2018-07-27 2018-12-18 开元通信技术(厦门)有限公司 SAW device and preparation method thereof

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63132514A (en) * 1986-11-21 1988-06-04 Mitsubishi Petrochem Co Ltd Surface acoustic wave element using high polymer piezoelectric body
WO2016052679A1 (en) * 2014-09-30 2016-04-07 京セラ株式会社 Sensor device
US11733240B2 (en) 2014-09-30 2023-08-22 Kyocera Corporation Sensor apparatus
CN105934667A (en) * 2014-09-30 2016-09-07 京瓷株式会社 Sensor device
JPWO2016052679A1 (en) * 2014-09-30 2017-04-27 京セラ株式会社 Sensor device
US10705080B2 (en) 2014-09-30 2020-07-07 Kyocera Corporation Sensor apparatus
JP2017215345A (en) * 2014-09-30 2017-12-07 京セラ株式会社 Sensor device
CN105934667B (en) * 2014-09-30 2019-09-24 京瓷株式会社 Sensor device
EP3214438A4 (en) * 2014-10-30 2018-05-30 Kyocera Corporation Sensor device
JP2017223699A (en) * 2014-10-30 2017-12-21 京セラ株式会社 Sensor device
JPWO2016068339A1 (en) * 2014-10-30 2017-04-27 京セラ株式会社 Sensor device
US11029288B2 (en) 2014-10-30 2021-06-08 Kyocera Corporation Sensor apparatus
WO2016068339A1 (en) * 2014-10-30 2016-05-06 京セラ株式会社 Sensor device
US12019051B2 (en) 2014-10-30 2024-06-25 Kyocera Corporation Sensor apparatus
CN109039298A (en) * 2018-07-27 2018-12-18 开元通信技术(厦门)有限公司 SAW device and preparation method thereof
CN109039298B (en) * 2018-07-27 2022-06-24 开元通信技术(厦门)有限公司 Surface acoustic wave device and method for manufacturing the same

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