JPS5571026A - Method and apparatus for grinding wafer - Google Patents
Method and apparatus for grinding waferInfo
- Publication number
- JPS5571026A JPS5571026A JP14420078A JP14420078A JPS5571026A JP S5571026 A JPS5571026 A JP S5571026A JP 14420078 A JP14420078 A JP 14420078A JP 14420078 A JP14420078 A JP 14420078A JP S5571026 A JPS5571026 A JP S5571026A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- slits
- holes
- film
- fixing table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To reduce vibrations and shocks such as striking of ground particles in grinding works and to prevent yields of scraches caused by rubbing, by intervening a flexible thin film between a fixing table and a wafer, in the case the wafer which is fixed by the fixing table is ground by a grindstone.
CONSTITUTION: A fixing table 6 having a plurality of air holes 9 is fixed to a chuck-base plate 8 by fixing screws 7, and flexible thin film 11 having a plurality of slits 12 is placed on or bonded to the upper surface of the table 6. The slits 12 are alingned with the holes 9. A wafer 2 is mounted on a the film 11, and is attracted by evacuation of air in an air hole 10, the holes 9, and the slits 12, thereby the film 11 and the wafer 2 are held. Then, the grinding is performed by a rotary grindstone 1.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14420078A JPS5571026A (en) | 1978-11-24 | 1978-11-24 | Method and apparatus for grinding wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14420078A JPS5571026A (en) | 1978-11-24 | 1978-11-24 | Method and apparatus for grinding wafer |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25850285A Division JPS61142061A (en) | 1985-11-20 | 1985-11-20 | Wafer grinding device |
| JP61130167A Division JPS62162455A (en) | 1986-06-06 | 1986-06-06 | Wafer grinding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5571026A true JPS5571026A (en) | 1980-05-28 |
Family
ID=15356536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14420078A Pending JPS5571026A (en) | 1978-11-24 | 1978-11-24 | Method and apparatus for grinding wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5571026A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169332A (en) * | 1980-05-31 | 1981-12-26 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPS6394630A (en) * | 1986-10-08 | 1988-04-25 | Rohm Co Ltd | Processing of rear of semiconductor wafer |
| JP2004510334A (en) * | 2000-09-27 | 2004-04-02 | ストラスバウ | Method for back-polishing a wafer while leaving a back polishing tape on the chuck |
| CN113878409A (en) * | 2021-09-29 | 2022-01-04 | 江苏宇航板业有限公司 | Sanding method of vermiculite calcium silicate plate with double-side sanding |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155494A (en) * | 1976-06-21 | 1977-12-23 | Nippon Telegr & Teleph Corp <Ntt> | Process for w orking parallel plane of wafer |
| JPS5342458U (en) * | 1976-09-16 | 1978-04-12 |
-
1978
- 1978-11-24 JP JP14420078A patent/JPS5571026A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155494A (en) * | 1976-06-21 | 1977-12-23 | Nippon Telegr & Teleph Corp <Ntt> | Process for w orking parallel plane of wafer |
| JPS5342458U (en) * | 1976-09-16 | 1978-04-12 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169332A (en) * | 1980-05-31 | 1981-12-26 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPS6394630A (en) * | 1986-10-08 | 1988-04-25 | Rohm Co Ltd | Processing of rear of semiconductor wafer |
| JP2004510334A (en) * | 2000-09-27 | 2004-04-02 | ストラスバウ | Method for back-polishing a wafer while leaving a back polishing tape on the chuck |
| CN113878409A (en) * | 2021-09-29 | 2022-01-04 | 江苏宇航板业有限公司 | Sanding method of vermiculite calcium silicate plate with double-side sanding |
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