JPS5564234A - Developing method of resist film - Google Patents
Developing method of resist filmInfo
- Publication number
- JPS5564234A JPS5564234A JP13704478A JP13704478A JPS5564234A JP S5564234 A JPS5564234 A JP S5564234A JP 13704478 A JP13704478 A JP 13704478A JP 13704478 A JP13704478 A JP 13704478A JP S5564234 A JPS5564234 A JP S5564234A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resist film
- developing solution
- center
- sprayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To reduce the thickness of the resist film evenly by spraying developing solution through a sprayer while letting the substrate having been coated with the resist film rotate within the substrate plane about the substrate centerline. CONSTITUTION:With a drive motor 6 being held stopped, the substrate 3 having been coated with a resist film 2 is sucked and fixed by means of a vacuum chuck 5 onto a substrate stage 4. At this time, the rotating center of the stage 4 and the center of the substrate 3 are aligned. Next, the substrate 3 is rotated by a motor 6, thence developing solution is spraued from the nozzle 1 of the sprayer which is located above the center of the substrate. At this time, the diameter of the nozzle 1 is so adjusted that the developing solution is sprayed to the entire surface of the substrate 3. Thereafter, rinsing process is immediately started to end the development.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13704478A JPS5564234A (en) | 1978-11-06 | 1978-11-06 | Developing method of resist film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13704478A JPS5564234A (en) | 1978-11-06 | 1978-11-06 | Developing method of resist film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5564234A true JPS5564234A (en) | 1980-05-14 |
Family
ID=15189546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13704478A Pending JPS5564234A (en) | 1978-11-06 | 1978-11-06 | Developing method of resist film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5564234A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62187680U (en) * | 1986-05-20 | 1987-11-28 | ||
US7586581B2 (en) | 2004-07-02 | 2009-09-08 | Sharp Kabushiki Kaisha | Developing method of photoresist and developing device |
-
1978
- 1978-11-06 JP JP13704478A patent/JPS5564234A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62187680U (en) * | 1986-05-20 | 1987-11-28 | ||
JPH0446860Y2 (en) * | 1986-05-20 | 1992-11-05 | ||
US7586581B2 (en) | 2004-07-02 | 2009-09-08 | Sharp Kabushiki Kaisha | Developing method of photoresist and developing device |
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