JPS5562191A - Bright copper-nickel-tin alloy electroplating bath - Google Patents
Bright copper-nickel-tin alloy electroplating bathInfo
- Publication number
- JPS5562191A JPS5562191A JP8985678A JP8985678A JPS5562191A JP S5562191 A JPS5562191 A JP S5562191A JP 8985678 A JP8985678 A JP 8985678A JP 8985678 A JP8985678 A JP 8985678A JP S5562191 A JPS5562191 A JP S5562191A
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- copper
- tin
- salt
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To enable the alloy plating of high luster, high corrosion resistance and high abrasion resistance to be obtained by adding one or more kinds of sulfur-contained amino acids and their salts to the bright copper-nickel-tin alloy plating bath using potassium pyrophosphate.
CONSTITUTION: One or more kinds of amino acids containing methionine, cystine, etc. and their hydrochlorides are added at 0.01g/l up to the range of solubility limit to the plating solution containing potassium pyrophosphate; 100W500g/l, copper salt; 0.5W3.2g/l as copper content, nickel salt; 3W40g/l as nickel content, tin salt; 10W60g/l as tin content. If electroplating is done by an ordinary method by using this plating method, co-deposition of three elements becomes possible and the alloy plating film of high mirror surface gloss is formed.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8985678A JPS5562191A (en) | 1978-07-21 | 1978-07-21 | Bright copper-nickel-tin alloy electroplating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8985678A JPS5562191A (en) | 1978-07-21 | 1978-07-21 | Bright copper-nickel-tin alloy electroplating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5562191A true JPS5562191A (en) | 1980-05-10 |
JPS5610392B2 JPS5610392B2 (en) | 1981-03-07 |
Family
ID=13982422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8985678A Granted JPS5562191A (en) | 1978-07-21 | 1978-07-21 | Bright copper-nickel-tin alloy electroplating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5562191A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112626575A (en) * | 2020-11-30 | 2021-04-09 | 杭州科技职业技术学院 | Surface electroplating liquid for alloy and electroplating process |
-
1978
- 1978-07-21 JP JP8985678A patent/JPS5562191A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112626575A (en) * | 2020-11-30 | 2021-04-09 | 杭州科技职业技术学院 | Surface electroplating liquid for alloy and electroplating process |
Also Published As
Publication number | Publication date |
---|---|
JPS5610392B2 (en) | 1981-03-07 |
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