JPS5562191A - Bright copper-nickel-tin alloy electroplating bath - Google Patents

Bright copper-nickel-tin alloy electroplating bath

Info

Publication number
JPS5562191A
JPS5562191A JP8985678A JP8985678A JPS5562191A JP S5562191 A JPS5562191 A JP S5562191A JP 8985678 A JP8985678 A JP 8985678A JP 8985678 A JP8985678 A JP 8985678A JP S5562191 A JPS5562191 A JP S5562191A
Authority
JP
Japan
Prior art keywords
nickel
copper
tin
salt
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8985678A
Other languages
Japanese (ja)
Other versions
JPS5610392B2 (en
Inventor
Hidehiko Enomoto
Yoshiji Shimizu
Shozo Sasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OOSAKASHI
SHIMIZU SHOJI KK
Osaka City
Original Assignee
OOSAKASHI
SHIMIZU SHOJI KK
Osaka City
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OOSAKASHI, SHIMIZU SHOJI KK, Osaka City filed Critical OOSAKASHI
Priority to JP8985678A priority Critical patent/JPS5562191A/en
Publication of JPS5562191A publication Critical patent/JPS5562191A/en
Publication of JPS5610392B2 publication Critical patent/JPS5610392B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To enable the alloy plating of high luster, high corrosion resistance and high abrasion resistance to be obtained by adding one or more kinds of sulfur-contained amino acids and their salts to the bright copper-nickel-tin alloy plating bath using potassium pyrophosphate.
CONSTITUTION: One or more kinds of amino acids containing methionine, cystine, etc. and their hydrochlorides are added at 0.01g/l up to the range of solubility limit to the plating solution containing potassium pyrophosphate; 100W500g/l, copper salt; 0.5W3.2g/l as copper content, nickel salt; 3W40g/l as nickel content, tin salt; 10W60g/l as tin content. If electroplating is done by an ordinary method by using this plating method, co-deposition of three elements becomes possible and the alloy plating film of high mirror surface gloss is formed.
COPYRIGHT: (C)1980,JPO&Japio
JP8985678A 1978-07-21 1978-07-21 Bright copper-nickel-tin alloy electroplating bath Granted JPS5562191A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8985678A JPS5562191A (en) 1978-07-21 1978-07-21 Bright copper-nickel-tin alloy electroplating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8985678A JPS5562191A (en) 1978-07-21 1978-07-21 Bright copper-nickel-tin alloy electroplating bath

Publications (2)

Publication Number Publication Date
JPS5562191A true JPS5562191A (en) 1980-05-10
JPS5610392B2 JPS5610392B2 (en) 1981-03-07

Family

ID=13982422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8985678A Granted JPS5562191A (en) 1978-07-21 1978-07-21 Bright copper-nickel-tin alloy electroplating bath

Country Status (1)

Country Link
JP (1) JPS5562191A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112626575A (en) * 2020-11-30 2021-04-09 杭州科技职业技术学院 Surface electroplating liquid for alloy and electroplating process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112626575A (en) * 2020-11-30 2021-04-09 杭州科技职业技术学院 Surface electroplating liquid for alloy and electroplating process

Also Published As

Publication number Publication date
JPS5610392B2 (en) 1981-03-07

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