JPS5543853A - Dicing - Google Patents
DicingInfo
- Publication number
- JPS5543853A JPS5543853A JP11653878A JP11653878A JPS5543853A JP S5543853 A JPS5543853 A JP S5543853A JP 11653878 A JP11653878 A JP 11653878A JP 11653878 A JP11653878 A JP 11653878A JP S5543853 A JPS5543853 A JP S5543853A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- tape
- elastic material
- sticked
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To minimize a failure on cut face from absorbing vibrations to occur at blade cutting by preparing a buffer consisting of an elastic material between stage and wafer.
CONSTITUTION: A plastic tape 12 consisting of an elastic material is sticked on a work loading face of a stage 10. The tape 12 comprises a ringed part 15 larger than the outside diameter of a wafer 14 to be sticked outside a groove 13 and a circular part 16 to be sticked inside the groove 13. Next, the wafer 14 is loaded on the tape 12 to vacuum adsorption and thus subjected to cutting. A force or a vibration to be applied on the wafer 14 at cutting is then absorbed in some degree by the tape 12 which consists of the elastic material, and hence there scarcely occurs such chipping or crack as will lead to defectiveness in appearance or characteristic.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11653878A JPS5543853A (en) | 1978-09-25 | 1978-09-25 | Dicing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11653878A JPS5543853A (en) | 1978-09-25 | 1978-09-25 | Dicing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5543853A true JPS5543853A (en) | 1980-03-27 |
Family
ID=14689594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11653878A Pending JPS5543853A (en) | 1978-09-25 | 1978-09-25 | Dicing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5543853A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5494549A (en) * | 1992-01-08 | 1996-02-27 | Rohm Co., Ltd. | Dicing method |
JP2003209071A (en) * | 2002-01-15 | 2003-07-25 | Towa Corp | Jig for cutting resin sealed substrate |
WO2006075356A1 (en) | 2005-01-11 | 2006-07-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor manufacturing apparatus |
GB2440532B (en) * | 2006-08-04 | 2011-09-21 | Roxbury Ltd | Internal partition wall |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979684A (en) * | 1972-12-07 | 1974-08-01 | ||
JPS49105445A (en) * | 1973-02-07 | 1974-10-05 | ||
JPS53100765A (en) * | 1977-02-15 | 1978-09-02 | Toshiba Corp | Production of semiconductor device |
-
1978
- 1978-09-25 JP JP11653878A patent/JPS5543853A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979684A (en) * | 1972-12-07 | 1974-08-01 | ||
JPS49105445A (en) * | 1973-02-07 | 1974-10-05 | ||
JPS53100765A (en) * | 1977-02-15 | 1978-09-02 | Toshiba Corp | Production of semiconductor device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5494549A (en) * | 1992-01-08 | 1996-02-27 | Rohm Co., Ltd. | Dicing method |
JP2003209071A (en) * | 2002-01-15 | 2003-07-25 | Towa Corp | Jig for cutting resin sealed substrate |
WO2006075356A1 (en) | 2005-01-11 | 2006-07-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor manufacturing apparatus |
JPWO2006075356A1 (en) * | 2005-01-11 | 2008-06-12 | 三菱電機株式会社 | Semiconductor manufacturing equipment |
JP4611292B2 (en) * | 2005-01-11 | 2011-01-12 | 三菱電機株式会社 | Semiconductor manufacturing equipment |
GB2440532B (en) * | 2006-08-04 | 2011-09-21 | Roxbury Ltd | Internal partition wall |
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