JPS5543853A - Dicing - Google Patents

Dicing

Info

Publication number
JPS5543853A
JPS5543853A JP11653878A JP11653878A JPS5543853A JP S5543853 A JPS5543853 A JP S5543853A JP 11653878 A JP11653878 A JP 11653878A JP 11653878 A JP11653878 A JP 11653878A JP S5543853 A JPS5543853 A JP S5543853A
Authority
JP
Japan
Prior art keywords
wafer
tape
elastic material
sticked
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11653878A
Other languages
Japanese (ja)
Inventor
Makoto Haneda
Kazuo Sugimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11653878A priority Critical patent/JPS5543853A/en
Publication of JPS5543853A publication Critical patent/JPS5543853A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To minimize a failure on cut face from absorbing vibrations to occur at blade cutting by preparing a buffer consisting of an elastic material between stage and wafer.
CONSTITUTION: A plastic tape 12 consisting of an elastic material is sticked on a work loading face of a stage 10. The tape 12 comprises a ringed part 15 larger than the outside diameter of a wafer 14 to be sticked outside a groove 13 and a circular part 16 to be sticked inside the groove 13. Next, the wafer 14 is loaded on the tape 12 to vacuum adsorption and thus subjected to cutting. A force or a vibration to be applied on the wafer 14 at cutting is then absorbed in some degree by the tape 12 which consists of the elastic material, and hence there scarcely occurs such chipping or crack as will lead to defectiveness in appearance or characteristic.
COPYRIGHT: (C)1980,JPO&Japio
JP11653878A 1978-09-25 1978-09-25 Dicing Pending JPS5543853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11653878A JPS5543853A (en) 1978-09-25 1978-09-25 Dicing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11653878A JPS5543853A (en) 1978-09-25 1978-09-25 Dicing

Publications (1)

Publication Number Publication Date
JPS5543853A true JPS5543853A (en) 1980-03-27

Family

ID=14689594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11653878A Pending JPS5543853A (en) 1978-09-25 1978-09-25 Dicing

Country Status (1)

Country Link
JP (1) JPS5543853A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494549A (en) * 1992-01-08 1996-02-27 Rohm Co., Ltd. Dicing method
JP2003209071A (en) * 2002-01-15 2003-07-25 Towa Corp Jig for cutting resin sealed substrate
WO2006075356A1 (en) 2005-01-11 2006-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing apparatus
GB2440532B (en) * 2006-08-04 2011-09-21 Roxbury Ltd Internal partition wall

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4979684A (en) * 1972-12-07 1974-08-01
JPS49105445A (en) * 1973-02-07 1974-10-05
JPS53100765A (en) * 1977-02-15 1978-09-02 Toshiba Corp Production of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4979684A (en) * 1972-12-07 1974-08-01
JPS49105445A (en) * 1973-02-07 1974-10-05
JPS53100765A (en) * 1977-02-15 1978-09-02 Toshiba Corp Production of semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494549A (en) * 1992-01-08 1996-02-27 Rohm Co., Ltd. Dicing method
JP2003209071A (en) * 2002-01-15 2003-07-25 Towa Corp Jig for cutting resin sealed substrate
WO2006075356A1 (en) 2005-01-11 2006-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing apparatus
JPWO2006075356A1 (en) * 2005-01-11 2008-06-12 三菱電機株式会社 Semiconductor manufacturing equipment
JP4611292B2 (en) * 2005-01-11 2011-01-12 三菱電機株式会社 Semiconductor manufacturing equipment
GB2440532B (en) * 2006-08-04 2011-09-21 Roxbury Ltd Internal partition wall

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