JP2003209071A - Jig for cutting resin sealed substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fig for cutting a resin sealed substrate in the process of forming a package while preventing the package from chipping. <P>SOLUTION: The jig 8 has a nest 6 as a part which includes latticed side walls 9, outer framed 16 which stand at the outmost of the side walls 9, a housing 10 of a quadrilateral space surrounded by each side wall 9 or the side walls 9 and the outer frames 16 for housing the package 23, holding walls 17 which are parts of the side walls and retreated from them, shelves 18 at the base of the holding walls 17 for catching the package 23, and an elastic member 19 made of an elastic material and placed on the outer frame 16. By this jig, unnecessary part 22 of the resin sealed substrate 1 is held by the elastic member 19 when the end of the substrate 1 is cut down by a blade 21. This protects the unnecessary part 22 from breaking down before the completion of cutting and prevents defects such as chipping of the package 23 from occurring. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention cuts a resin-sealed substrate in which a plurality of chip-shaped electronic components (hereinafter referred to as chips) are resin-sealed to form a package including individual chips. The present invention relates to a jig for cutting a resin-sealed substrate, which is used when performing.

[0002]

2. Description of the Related Art A conventional jig for cutting a resin-sealed substrate will be described with reference to FIG. 4 (A), (B),
(C) is a step of cutting the resin-sealed substrate using a conventional jig for cutting the resin-sealed substrate, a step of holding each package, and a step of cleaning and drying each package. It is a fragmentary sectional view showing and respectively. As shown in FIG. 4A, the nest 50, which is a housing member that houses the package, and the platform 51, which is a suction member, together form a cutting jig 52. Nest 50 is
An accommodating portion 55 including a lattice-shaped side wall 53, an outer frame 54, a space surrounded by the side walls 53, and between the side wall 53 and the outer frame 54.
And a holding wall 56 which is composed of the side wall 53 and a part of the outer frame 54 and whose wall surface is retracted, and a shelf 57 at the base of the holding wall 56.
Composed of and. In addition, the platform 51 includes a suction portion 58 that protrudes corresponding to each package, and a suction portion 58.
And a suction port 60 provided in the recess 59.

A conventional cutting jig 52, that is, a nest 50 as a housing member and a platform 51 as a suction member.
And are used as follows. First, as shown in FIG. 4A, the nest 50 and the platform 51 are combined, the resin-sealed substrate 61 is adsorbed through the suction port 60, and then the resin-sealed substrate 61 is cut by the blade 62. . Then, the unnecessary portion 63 composed of the end portion of the resin-sealed substrate 61 falls and flows out together with the cutting water (not shown). Next, as shown in FIG. 4B, when the resin-sealed substrate 61 is cut into all the packages 64, the nest 50 is lifted after releasing the suction. As a result, each package 64 is accommodated in each accommodation portion 55 of the nest 50.
, The retaining wall 56 is engaged with the shelf 57.
It is held so as not to move largely in the horizontal direction of the figure. Then, in order to hold each package 64 so that it does not move much in the vertical direction of the drawing, a lid 65 is held.
To lower. Here, the package pressing portion 66 of the lid 65 is located above the corner of the package 64,
The nest pressing portion 67 of is positioned above the outer frame 54 of the nest 50, and the lid 65 is lowered. Further, the lid 65 is provided with an opening 68 above the central portion of the package 64.

Next, as shown in FIG. 4C, the nest pressing portion 67 and the outer frame 54 are brought into pressure contact with each other. As a result, the package 64 has the package pressing portion 66 at the corner.
From the above, a predetermined gap is maintained so that the vertical direction of the drawing does not significantly move. In this state, the nest 50 is put in a washing tank to wash the package 64 with a washing liquid, and then put in a dryer to dry the package 64 with dry air or the like. As indicated by the thick arrow in the figure, the cleaning liquid in the cleaning process and the dry air in the drying process are narrow between the lid 65 and the package 64, between the holding wall 56 and the package 64, and between the shelf 57 and the package 64, respectively. Flow through space.

Next, in the inspection step, with the lid 65 removed, the package 64 is photographed by a CCD camera under illumination. Then, image processing is performed on the basis of the obtained image data, and there is no defect in the electrodes (not shown) of the package 64, or there is no abnormality in the appearance (chipping) or minute cracks (microcracks). For each item, a predetermined inspection is performed for each package 64.

[0006]

However, according to the above-mentioned conventional resin-sealed substrate cutting jig, when the resin-sealed substrate 61 is cut, the portions corresponding to the respective packages 64 are sucked. It is adsorbed by the portion 58. On the other hand, the end portion, that is, the unnecessary portion 63 shown in FIG.
Is not adsorbed. Therefore, due to vibration of the blade 62 or the like, the unnecessary portion 63 may be naturally broken and dropped before the cutting is completed. In this case, electrodes (not shown) are provided on the package 64 located at the end.
Defects, chipping in appearance, defects such as microcracks, etc. may occur.

The present invention has been made to solve the above problems, and provides a jig for cutting a resin-sealed substrate, which reduces package defects when the resin-sealed substrate is cut. The purpose is to do.

[0008]

For the purpose of solving the above technical problems, a jig for cutting a resin-sealed substrate according to the present invention has a plurality of chip-shaped electronic components resin-sealed. Used when forming a package consisting of individual pieces containing electronic components by cutting the resin-sealed substrate,
A resin-sealed substrate including an adsorption member having an adsorption portion for adsorbing an individual area corresponding to each package in the resin-sealed substrate and an accommodation member having a lattice-shaped accommodation portion for accommodating each package The jig for cutting, characterized in that it is provided with a supporting portion for supporting the vicinity of the end portion of the resin-sealed substrate.

According to this, when the resin-sealed substrate is cut, the vicinity of the end is supported by the supporting portion until the resin-sealed substrate is completely cut. This prevents breakage of the end portion before the completion of cutting. Therefore,
In the package connected to the end, defects such as electrode loss, chipping in appearance, and microcracks are reduced.

Further, the resin-sealed substrate cutting jig according to the present invention is characterized in that, in the above-mentioned cutting jig, the supporting portion is provided on either the suction member or the housing member. .

According to this, when the resin-sealed substrate is cut, the vicinity of the end is supported by the supporting portion provided on the suction member or the accommodating member until the resin-sealed substrate is completely cut. To be done. This prevents breakage of the end portion before the completion of cutting. Therefore, defects such as electrode defects, chipping in appearance, and microcracks are reduced in the package connected to the ends.

Further, in the cutting jig for a resin-sealed substrate according to the present invention, in the above-mentioned cutting jig, the elastic material supports the vicinity of the end portion of the resin-sealed substrate in the supporting portion. It is characterized by

According to this, even when the resin-sealed substrate has a warp or undulation, the elastic supporting portion is deformed, so that the vicinity of the end portion of the resin-sealed substrate is reliably supported. It

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) A first embodiment of a jig for cutting a resin-sealed substrate according to the present invention will be described below with reference to FIGS. 1 and 2. . FIG. 1 is a perspective view schematically showing a state in which a jig for cutting a resin-sealed substrate according to the present invention, that is, a nest and a platform are used.

As shown in FIG. 1, the resin-sealed substrate 1 to be cut is composed of a substrate body 2 made of a printed circuit board, a lead frame and the like, and a sealing resin 3. The substrate body 2 is virtually provided with a dicing line 4 which is a cutting position. A portion surrounded by each dicing line 4 is an individual area 5 to which one chip is usually mounted and, in some cases, a plurality of chips (not shown) are mounted, and each package should be formed after cutting.

The nest 6 is a housing member for housing a package (not shown). The platform 7 is made of rubber, for example, and is used in combination with the nest 6,
The individual regions 5 of the resin-sealed substrate 1 are suction members that are respectively sucked. Nest 6 and platform 7 together,
The cutting jig 8 according to the present invention is configured.

Further, the nest 6 has side walls 9 provided in a lattice shape, and an accommodating portion 10 which is a quadrilateral space surrounded by the side walls 9 and which accommodates a package. Here, the nest 6 is made of a metal material such as stainless steel. In FIG. 1, a part of the nest 6 is omitted because the drawing is complicated, and the omitted part will be described later. The platform 7 is the table 1
It is fixed at 1. In the platform 7, the suction portion 12 is a convex portion that sucks and holds each package. The recess 13 is a space for suction provided on the upper surface of the suction unit 12. The suction port 14 is an outlet of a suction conduit provided in the recess 13 and connected to the vacuum pump 15.

The shape of the nest 6 shown in FIG. 1, including the parts omitted in FIG. 1, will be described with reference to FIG. 2A, 2B, and 2C show a step of holding the resin-sealed substrate and a step of cutting the resin-sealed substrate using the cutting jig according to the present embodiment. FIG. 7 is a partial cross-sectional view showing a step of covering each package with a lid.

As shown in FIGS. 2A and 2B, in the nest 6, the outermost outer frame 16 of the side walls 9 is formed.
A holding wall 17 that is a part of the outer frame 16 and whose wall surface is retracted is provided in the. Similarly, the side wall 9 provided inside the outer frame 16 is provided with a holding wall 17 which is a part of the side wall 9 and whose wall surface is retracted. These holding walls 17 are omitted in FIG. Holding wall 17
At the root of the, that is, the part connected to the side wall 9,
Is provided. On the upper surface of the outer frame 16, an elastic member 19 made of an elastic material such as a polymer material is used.
Is provided. Here, in a state where the nest 6 and the platform 7 are combined, the upper surface of the elastic member 19 is provided so as to be located on the same plane as or slightly below the upper surface of the suction section 12. The outer frame 1
6 and the elastic member 19 together form a support portion 20.

A process of using the resin-sealed substrate cutting jig 8 according to the present embodiment, that is, the nest 6 and the platform 7 will be described with reference to FIG. In FIG. 2, a blade 21 is a rotary blade for cutting the resin-sealed substrate 1 to form a package. Unnecessary part 22
Is the end of the resin-sealed substrate 1 and is the package 23
Is a part that is not formed and is a part that is discarded. The lid 24 is a member that covers the nest 6 and suppresses a large movement of each package 23, and has a package pressing portion 25 made of a grid-like rib and a nest pressing portion 26 made of a rib on the outer peripheral portion. The nest pressing portion 26 is provided so as to protrude below the package pressing portion 25. Further, the ceiling plate of the lid 24 is provided with an opening 27 at a portion corresponding to the upper center portion of each package 23.

First, as shown in FIG. 2A, the nest 6
After the resin-sealed substrate 1 is adsorbed through the suction port 14 by combining the and the platform 7, the blade 21 is moved to a position above the most end line of the dicing line 4.

Next, as shown in FIG. 2B, the resin-sealed substrate 1 is cut by the blade 21. Here, since the blade 21 presses the resin-sealed substrate 1, the suction portion 1
2 is slightly compressed, and the unnecessary portion 22 is supported by the elastic member 19 of the support portion 20.

Next, as shown in FIG. 2C, when the resin-sealed substrate 1 is cut into all the packages 23,
After releasing the suction, the nest 6 is raised. As a result, each package 23 is locked to the shelf 18 in each accommodation portion 10 of the nest 6 and is held by the holding wall 17 so as not to move largely in the horizontal direction in the drawing. Then, the lid 24 is lowered and each package 2
3 is held so as not to move much in the vertical direction of the figure. Here, the package pressing portion 25 of the lid 24 is located above the corner portion of the package 23, and the nest pressing portion 26 of the lid 24 is located above the outer frame 16 of the nest 6, so that the lid 21 is lowered. . As a result, the nest pressing portion 26 and the outer frame 16 are brought into pressure contact with each other, and the package 23
At a corner with a predetermined gap from the package pressing unit 25 so as not to move significantly in the vertical direction in the drawing. In other words, the package 23 is held so as to be movable in the small gaps provided between the package 6 and the nest 6 and the lid 24, respectively.

In this state, the nest 6 is put in the cleaning tank and the package 23 is cleaned with the cleaning liquid. Further, the nest 6 is put in a dryer and the package 23 is dried by dry air or the like.

Next, after removing the lid 24, the package 23 is photographed by a CCD camera (not shown) above the package 23. Then, image processing is performed on the basis of the obtained image data, and the items such as whether the electrodes (not shown) of the package 23 are defective or whether the appearance of the package 23 is abnormal such as chipping is determined for each package 23. Perform a predetermined inspection.

As described above, according to this embodiment, the unnecessary portion 22 is supported by the elastic member 19 of the supporting portion 20, so that the unnecessary portion 2 is not cut until the cutting is completed.
2 does not break and fall. Therefore, in the package 23 connected to the unnecessary portion 22, the unnecessary portion 2
Defects such as chipping of electrodes, chipping in appearance, and microcracks, which occur due to breakage and drop of 2 are reduced.

(Second Embodiment) A second embodiment of a jig for cutting a resin-sealed substrate according to the present invention will be described below with reference to FIG. 3 (A), (B), (C)
Includes a step of holding the resin-sealed substrate using the cutting jig according to the present embodiment, a step of cutting the resin-sealed substrate, and a step of holding each package with a lid. It is a partial sectional view showing each.

As shown in FIG. 3A, in this embodiment, an elastic member 29 made of an elastic material such as a polymer material is provided on the upper surface of the outer frame 28 of the platform 7. ing. Here, as in the first embodiment, in a state where the nest 6 and the platform 7 are combined, the upper surface of the elastic member 29 is flush with or slightly lower than the upper surface of the suction portion 12. It is provided to do. The outer frame 28 and the elastic member 29 together constitute a support portion 30. An outer frame 31 is provided on the outer edge of the nest 6.

A process of using the resin-sealed substrate cutting jig 8 according to this embodiment, that is, the nest 6 and the platform 7 will be described with reference to FIG. First, as in the first embodiment, in FIG. 3A, after the resin-sealed substrate 1 is adsorbed through the suction port 14, the blade is placed above the most end line of the dicing line 4. 21 is moved.

Next, as shown in FIG. 3B, the resin-sealed substrate 1 is cut by the blade 21. Here, since the blade 21 presses the resin-sealed substrate 1, the suction portion 1
2 is slightly compressed, and the unnecessary portion 22 is supported by the elastic member 29 of the support portion 30.

Next, as shown in FIG. 3C, when the resin-sealed substrate 1 is cut into all the packages 23,
After the suction is released, the nest 6 is raised and the lid 24 is lowered to bring the nest pressing portion 26 and the outer frame 31 of the nest 6 into pressure contact with each other. As a result, the package 23
Are held movably in a slight gap provided with the nest 6 and with the lid 24, respectively. Subsequently, as in the first embodiment, cleaning, drying, and inspection of the package 23 are sequentially performed.

As described above, according to the present embodiment, since the unnecessary portion 22 is supported by the elastic member 29 of the supporting portion 30, the unnecessary portion 2 is cut until the cutting is completed.
2 does not break and fall. Therefore, similar to the first embodiment, in the package 23 connected to the unnecessary portion 22, defects such as electrode defects, chipping in appearance, and microcracks are reduced.

In this embodiment, if the unnecessary portion 22 has a sufficient space, the suction portion 12 that sucks the unnecessary portion 22 may be provided as a support portion.

In each of the above embodiments, the elastic members 19 and 29 are provided on the outer frame 16 of the nest 6 or the outer frame 28 of the platform 7. These elastic members 19 and 29 are provided in consideration of the case where the resin-sealed substrate 1 before cutting has warp, undulation, or the like. That is, the elastic members 19 and 29 are provided in order to reliably support the end portion of the resin-sealed substrate 1 and to adsorb the end portion of the portion corresponding to each package 23 well. Therefore, the resin-sealed substrate 1
When the warp, undulation, etc. are small enough to cause no problem, the upper surfaces of the outer frames 16, 28 may be flush with the upper surface of the suction portion 12 without providing the elastic members 19, 29.

Further, when the nest 6 and the platform 7 are combined, the upper surfaces of the elastic members 19 and 29 are provided so as to be flush with or slightly below the upper surface of the suction portion 12. There is. Not limited to this,
When a material having a large deformation amount is used as the elastic members 19 and 29, the upper surfaces of the elastic members 19 and 29 are attached to the suction portion 12
It may be provided so as to be located slightly above the upper surface of the. In this case, the elastic members 19 and 29 are deformed when the resin-sealed substrate 1 is adsorbed and ensure adsorption, and further deformed when the resin-sealed substrate 1 is cut. The unnecessary portion 22 will be supported.

Further, although the side of the sealing resin 3 is adsorbed on the resin-sealed substrate 1, the invention is not limited to this. It can also be adsorbed.

Further, the suction portion 12 sucks the sealing resin 3 of the resin-sealed substrate 1, and the elastic members 19 and 29 support the sealing resin 3 in the unnecessary portion 22. Not limited to this, the elastic members 19 and 29 may support the substrate body 2 in the unnecessary portion 22. In this case, the upper surface of the elastic member 29 may be provided so as to be located on the same plane or slightly below the joint surface between the substrate body 2 and the sealing resin 3.

[0038]

According to the present invention, when the resin-sealed substrate is cut, the end portion is supported by the supporting portion until the resin-sealed substrate is completely cut. As a result, breakage of the end portion before the completion of cutting is prevented, and defects in the package connected to the end portion are reduced. Further, even if the resin-sealed substrate has a warp or a swell, the end portion of the resin-sealed substrate is reliably supported by the deformation of the elastic support portion.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing a state where a jig for cutting a resin-sealed substrate according to the present invention, that is, a nest and a platform are used.

2 (A), (B), and (C) are a step of holding a resin-sealed substrate using the cutting jig according to the first embodiment of the present invention, and resin sealing. FIG. 7 is a partial cross-sectional view showing a step of cutting the finished substrate and a step of closing the finished substrate and holding each package.

3 (A), (B), and (C) are a step of holding a resin-sealed substrate by using a cutting jig according to a second embodiment of the present invention, and a resin sealing step. FIG. 7 is a partial cross-sectional view showing a step of cutting the finished substrate and a step of closing the finished substrate and holding each package.

4A, 4B, and 4C show a step of cutting a resin-sealed substrate using a conventional jig for cutting a resin-sealed substrate, and holding each package. It is a fragmentary sectional view showing a process and a process of cleaning and drying each package, respectively.

[Explanation of symbols]

1 Resin-sealed substrate 2 Board body 3 Sealing resin 4 dicing line 5 individual areas 6 Nest (accommodation member) 7 platform (adsorption member) 8 Cutting jig 9 Side wall 10 accommodation 11 table 12 Adsorption part 13 recess 14 Suction port 15 Vacuum pump 16, 28, 31 outer frame 17 retaining wall 18 shelves 19,29 Elastic member 20, 30 Support 21 blade 22 unnecessary parts 23 packages 24 lid 25 Package holder 26 Nest presser 27 openings

Claims (3)

[Claims] 1. A resin-encapsulated substrate, which is used for forming a package including individual pieces containing the electronic component by cutting a resin-encapsulated substrate in which a plurality of chip-shaped electronic components are resin-encapsulated. Of a resin-sealed substrate, which comprises an adsorption member having an adsorption portion for adsorbing individual regions corresponding to the respective packages in the completed substrate, and an accommodation member having a lattice-shaped accommodation portion for accommodating each of the packages. A jig for cutting a resin-sealed substrate, comprising a supporting portion for supporting the vicinity of an end portion of the resin-sealed substrate. 2. The jig for cutting a resin-sealed substrate according to claim 1, wherein the supporting portion is provided on either the suction member or the housing member. A jig for cutting boards. 3. The jig for cutting a resin-sealed substrate according to claim 1, wherein an elastic material supports the vicinity of an end of the resin-sealed substrate in the supporting portion. A jig for cutting a resin-sealed substrate, which is characterized by: