JPS55102234A - Cutting method of semiconductor substrate and its device - Google Patents
Cutting method of semiconductor substrate and its deviceInfo
- Publication number
- JPS55102234A JPS55102234A JP950379A JP950379A JPS55102234A JP S55102234 A JPS55102234 A JP S55102234A JP 950379 A JP950379 A JP 950379A JP 950379 A JP950379 A JP 950379A JP S55102234 A JPS55102234 A JP S55102234A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cutter
- damage
- semiconductor substrate
- turned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE: To shape a substrate without damage by making the main face of cutter contact with the edge of semiconductor substrate at an angle of 40° or more and by making the cutter and its mounting part or a part of the substrate holder of elastic substance.
CONSTITUTION: The substrate 1 is attached to the holder 3 by vacuumizing and is turned at a fixed speed. The cutter 4 turned at high speed is fed to make itself contact with the substrate by means of the feed mechanism 7. Since the impulsive force applied to the cutter 4 is absorbed and relaxed by the elastic body 5, the impulse applied to the substrate is made extremely less to prevent damage. Also, when the angle α made by the main face of the cutter with that of the substrate is 40° or more, the vertical component of the pressing force of the cutter is made less, the substrate can safely be shaped without damage.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP950379A JPS55102234A (en) | 1979-01-29 | 1979-01-29 | Cutting method of semiconductor substrate and its device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP950379A JPS55102234A (en) | 1979-01-29 | 1979-01-29 | Cutting method of semiconductor substrate and its device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55102234A true JPS55102234A (en) | 1980-08-05 |
Family
ID=11722037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP950379A Pending JPS55102234A (en) | 1979-01-29 | 1979-01-29 | Cutting method of semiconductor substrate and its device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55102234A (en) |
-
1979
- 1979-01-29 JP JP950379A patent/JPS55102234A/en active Pending
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