JPS55102234A - Cutting method of semiconductor substrate and its device - Google Patents

Cutting method of semiconductor substrate and its device

Info

Publication number
JPS55102234A
JPS55102234A JP950379A JP950379A JPS55102234A JP S55102234 A JPS55102234 A JP S55102234A JP 950379 A JP950379 A JP 950379A JP 950379 A JP950379 A JP 950379A JP S55102234 A JPS55102234 A JP S55102234A
Authority
JP
Japan
Prior art keywords
substrate
cutter
damage
semiconductor substrate
turned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP950379A
Other languages
Japanese (ja)
Inventor
Susumu Furuike
Seiji Ohashi
Hitoo Iwasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP950379A priority Critical patent/JPS55102234A/en
Publication of JPS55102234A publication Critical patent/JPS55102234A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To shape a substrate without damage by making the main face of cutter contact with the edge of semiconductor substrate at an angle of 40° or more and by making the cutter and its mounting part or a part of the substrate holder of elastic substance.
CONSTITUTION: The substrate 1 is attached to the holder 3 by vacuumizing and is turned at a fixed speed. The cutter 4 turned at high speed is fed to make itself contact with the substrate by means of the feed mechanism 7. Since the impulsive force applied to the cutter 4 is absorbed and relaxed by the elastic body 5, the impulse applied to the substrate is made extremely less to prevent damage. Also, when the angle α made by the main face of the cutter with that of the substrate is 40° or more, the vertical component of the pressing force of the cutter is made less, the substrate can safely be shaped without damage.
COPYRIGHT: (C)1980,JPO&Japio
JP950379A 1979-01-29 1979-01-29 Cutting method of semiconductor substrate and its device Pending JPS55102234A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP950379A JPS55102234A (en) 1979-01-29 1979-01-29 Cutting method of semiconductor substrate and its device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP950379A JPS55102234A (en) 1979-01-29 1979-01-29 Cutting method of semiconductor substrate and its device

Publications (1)

Publication Number Publication Date
JPS55102234A true JPS55102234A (en) 1980-08-05

Family

ID=11722037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP950379A Pending JPS55102234A (en) 1979-01-29 1979-01-29 Cutting method of semiconductor substrate and its device

Country Status (1)

Country Link
JP (1) JPS55102234A (en)

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