JPS5541540B2 - - Google Patents
Info
- Publication number
- JPS5541540B2 JPS5541540B2 JP10894375A JP10894375A JPS5541540B2 JP S5541540 B2 JPS5541540 B2 JP S5541540B2 JP 10894375 A JP10894375 A JP 10894375A JP 10894375 A JP10894375 A JP 10894375A JP S5541540 B2 JPS5541540 B2 JP S5541540B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10894375A JPS5233089A (en) | 1975-09-10 | 1975-09-10 | Bus bar of printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10894375A JPS5233089A (en) | 1975-09-10 | 1975-09-10 | Bus bar of printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5233089A JPS5233089A (en) | 1977-03-12 |
JPS5541540B2 true JPS5541540B2 (enrdf_load_html_response) | 1980-10-24 |
Family
ID=14497569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10894375A Granted JPS5233089A (en) | 1975-09-10 | 1975-09-10 | Bus bar of printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5233089A (enrdf_load_html_response) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61119022A (ja) * | 1984-11-15 | 1986-06-06 | 松下電器産業株式会社 | フイルムコンデンサ |
JP2006323574A (ja) * | 2005-05-18 | 2006-11-30 | Hitachi Ltd | ディスクアレイ装置 |
FR2909254B1 (fr) * | 2006-11-23 | 2009-01-09 | Siemens Vdo Automotive Sas | Bus de conduction thermique, notamment pour unite de calcul a microprocesseur. |
JP2009259875A (ja) * | 2008-04-11 | 2009-11-05 | Tdk-Lambda Corp | 端子付き板金、および基板と端子付き板金との接続構造 |
JP5271624B2 (ja) * | 2008-07-16 | 2013-08-21 | Tdkラムダ株式会社 | 半田接続構造及び電源装置 |
JP2010092918A (ja) * | 2008-10-03 | 2010-04-22 | Toyota Industries Corp | 板状電極とブロック状電極との接続構造及び接続方法 |
JP5904928B2 (ja) * | 2012-11-13 | 2016-04-20 | 三菱電機株式会社 | 電流補助部材およびプリント基板 |
JP6187884B2 (ja) * | 2015-11-19 | 2017-08-30 | 株式会社安川電機 | 電力変換装置 |
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1975
- 1975-09-10 JP JP10894375A patent/JPS5233089A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5233089A (en) | 1977-03-12 |