JPS5233089A - Bus bar of printed board - Google Patents

Bus bar of printed board

Info

Publication number
JPS5233089A
JPS5233089A JP10894375A JP10894375A JPS5233089A JP S5233089 A JPS5233089 A JP S5233089A JP 10894375 A JP10894375 A JP 10894375A JP 10894375 A JP10894375 A JP 10894375A JP S5233089 A JPS5233089 A JP S5233089A
Authority
JP
Japan
Prior art keywords
bus bar
printed board
soldering
pin
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10894375A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5541540B2 (enrdf_load_html_response
Inventor
Hideaki Sonoda
Hiroaki Onishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10894375A priority Critical patent/JPS5233089A/ja
Publication of JPS5233089A publication Critical patent/JPS5233089A/ja
Publication of JPS5541540B2 publication Critical patent/JPS5541540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP10894375A 1975-09-10 1975-09-10 Bus bar of printed board Granted JPS5233089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10894375A JPS5233089A (en) 1975-09-10 1975-09-10 Bus bar of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10894375A JPS5233089A (en) 1975-09-10 1975-09-10 Bus bar of printed board

Publications (2)

Publication Number Publication Date
JPS5233089A true JPS5233089A (en) 1977-03-12
JPS5541540B2 JPS5541540B2 (enrdf_load_html_response) 1980-10-24

Family

ID=14497569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10894375A Granted JPS5233089A (en) 1975-09-10 1975-09-10 Bus bar of printed board

Country Status (1)

Country Link
JP (1) JPS5233089A (enrdf_load_html_response)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119022A (ja) * 1984-11-15 1986-06-06 松下電器産業株式会社 フイルムコンデンサ
JP2006323574A (ja) * 2005-05-18 2006-11-30 Hitachi Ltd ディスクアレイ装置
JP2008147647A (ja) * 2006-11-23 2008-06-26 Siemens Vdo Automotive 特にマイクロプロセッサ型計算ユニットのための熱伝導バス
JP2009259875A (ja) * 2008-04-11 2009-11-05 Tdk-Lambda Corp 端子付き板金、および基板と端子付き板金との接続構造
JP2010028930A (ja) * 2008-07-16 2010-02-04 Tdk-Lambda Corp 半田接続構造及び電源装置
JP2010092918A (ja) * 2008-10-03 2010-04-22 Toyota Industries Corp 板状電極とブロック状電極との接続構造及び接続方法
JP2014099460A (ja) * 2012-11-13 2014-05-29 Mitsubishi Electric Corp 電流補助部材およびプリント基板
JP2017098329A (ja) * 2015-11-19 2017-06-01 株式会社安川電機 電力変換装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119022A (ja) * 1984-11-15 1986-06-06 松下電器産業株式会社 フイルムコンデンサ
JP2006323574A (ja) * 2005-05-18 2006-11-30 Hitachi Ltd ディスクアレイ装置
JP2008147647A (ja) * 2006-11-23 2008-06-26 Siemens Vdo Automotive 特にマイクロプロセッサ型計算ユニットのための熱伝導バス
JP2009259875A (ja) * 2008-04-11 2009-11-05 Tdk-Lambda Corp 端子付き板金、および基板と端子付き板金との接続構造
JP2010028930A (ja) * 2008-07-16 2010-02-04 Tdk-Lambda Corp 半田接続構造及び電源装置
JP2010092918A (ja) * 2008-10-03 2010-04-22 Toyota Industries Corp 板状電極とブロック状電極との接続構造及び接続方法
JP2014099460A (ja) * 2012-11-13 2014-05-29 Mitsubishi Electric Corp 電流補助部材およびプリント基板
JP2017098329A (ja) * 2015-11-19 2017-06-01 株式会社安川電機 電力変換装置
US10021815B2 (en) 2015-11-19 2018-07-10 Kabushiki Kaisha Yaskawa Denki Power conversion apparatus

Also Published As

Publication number Publication date
JPS5541540B2 (enrdf_load_html_response) 1980-10-24

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