JPS5538088A - Resin sealing device - Google Patents

Resin sealing device

Info

Publication number
JPS5538088A
JPS5538088A JP11208078A JP11208078A JPS5538088A JP S5538088 A JPS5538088 A JP S5538088A JP 11208078 A JP11208078 A JP 11208078A JP 11208078 A JP11208078 A JP 11208078A JP S5538088 A JPS5538088 A JP S5538088A
Authority
JP
Japan
Prior art keywords
burrs
platen
sealing device
resin sealing
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11208078A
Other languages
English (en)
Japanese (ja)
Other versions
JPS614183B2 (enExample
Inventor
Kazuki Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP11208078A priority Critical patent/JPS5538088A/ja
Publication of JPS5538088A publication Critical patent/JPS5538088A/ja
Publication of JPS614183B2 publication Critical patent/JPS614183B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • B29C45/1744—Mould support platens

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP11208078A 1978-09-11 1978-09-11 Resin sealing device Granted JPS5538088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11208078A JPS5538088A (en) 1978-09-11 1978-09-11 Resin sealing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11208078A JPS5538088A (en) 1978-09-11 1978-09-11 Resin sealing device

Publications (2)

Publication Number Publication Date
JPS5538088A true JPS5538088A (en) 1980-03-17
JPS614183B2 JPS614183B2 (enExample) 1986-02-07

Family

ID=14577571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11208078A Granted JPS5538088A (en) 1978-09-11 1978-09-11 Resin sealing device

Country Status (1)

Country Link
JP (1) JPS5538088A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655057A (en) * 1979-10-12 1981-05-15 Fujitsu Ltd Manufacture of semiconductor device
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS59159717A (ja) * 1983-03-03 1984-09-10 有限会社　コンペックス 人工ホダ木あるいは人工菌床ならびに茸栽培法
JPS6016525A (ja) * 1983-07-07 1985-01-28 岡本　広司 きのこ栽培用原木の製造方法
JPS61274918A (ja) * 1985-04-15 1986-12-05 ベルント・シエンク 合成樹脂成形体、特に合成樹脂中空体の製造装置
JPS6431425A (en) * 1987-07-27 1989-02-01 Mitsubishi Electric Corp Resin sealing apparatus for semiconductor device
NL1005283C2 (nl) * 1997-02-14 1998-08-18 3P Licensing Bv Matrijssamenstel met verende afsteuning.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655057A (en) * 1979-10-12 1981-05-15 Fujitsu Ltd Manufacture of semiconductor device
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS59159717A (ja) * 1983-03-03 1984-09-10 有限会社　コンペックス 人工ホダ木あるいは人工菌床ならびに茸栽培法
JPS6016525A (ja) * 1983-07-07 1985-01-28 岡本　広司 きのこ栽培用原木の製造方法
JPS61274918A (ja) * 1985-04-15 1986-12-05 ベルント・シエンク 合成樹脂成形体、特に合成樹脂中空体の製造装置
JPS6431425A (en) * 1987-07-27 1989-02-01 Mitsubishi Electric Corp Resin sealing apparatus for semiconductor device
NL1005283C2 (nl) * 1997-02-14 1998-08-18 3P Licensing Bv Matrijssamenstel met verende afsteuning.

Also Published As

Publication number Publication date
JPS614183B2 (enExample) 1986-02-07

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