JPS5536959A - Cooling apparatus for semiconductor transformation device - Google Patents

Cooling apparatus for semiconductor transformation device

Info

Publication number
JPS5536959A
JPS5536959A JP10923678A JP10923678A JPS5536959A JP S5536959 A JPS5536959 A JP S5536959A JP 10923678 A JP10923678 A JP 10923678A JP 10923678 A JP10923678 A JP 10923678A JP S5536959 A JPS5536959 A JP S5536959A
Authority
JP
Japan
Prior art keywords
cylinder
cooling
case
cooling medium
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10923678A
Other languages
Japanese (ja)
Inventor
Tadao Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Electric Manufacturing Co Ltd
Original Assignee
Meidensha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Electric Manufacturing Co Ltd filed Critical Meidensha Electric Manufacturing Co Ltd
Priority to JP10923678A priority Critical patent/JPS5536959A/en
Publication of JPS5536959A publication Critical patent/JPS5536959A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve cooling efficiency and to smallize and lighten heat generation parts by cooling in utilization of vaporization latent heat of cooling medium.
CONSTITUTION: Semiconductor transformer 2 is housed in a case 1 and a nozzle 3a of a cylinder 3 filled with cooling medium such as liquid air or liquid nitrogen is disposed in the case projectly. And a cock 4 of the cylinder 3 is properly released in response to the load of the device 2 to control exit amount of the cooling medium. The apparatus 2 is cooled as taking vaporization latent heat from circumference by that the liquid in the cylinder 3 is vaporized and expansioned in the cooling part 4 through the nozzle 3a. The gas which cooled the device 2 is discharged after circulating in the case 1. The cylinder is releasable and exchangeable. Thus, cooling efficiency is improved and heat generation parts can be smallized and lightened.
COPYRIGHT: (C)1980,JPO&Japio
JP10923678A 1978-09-06 1978-09-06 Cooling apparatus for semiconductor transformation device Pending JPS5536959A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10923678A JPS5536959A (en) 1978-09-06 1978-09-06 Cooling apparatus for semiconductor transformation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10923678A JPS5536959A (en) 1978-09-06 1978-09-06 Cooling apparatus for semiconductor transformation device

Publications (1)

Publication Number Publication Date
JPS5536959A true JPS5536959A (en) 1980-03-14

Family

ID=14505055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10923678A Pending JPS5536959A (en) 1978-09-06 1978-09-06 Cooling apparatus for semiconductor transformation device

Country Status (1)

Country Link
JP (1) JPS5536959A (en)

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