JPS5531184A - Nonelectrolytic gold-plating solution - Google Patents

Nonelectrolytic gold-plating solution

Info

Publication number
JPS5531184A
JPS5531184A JP10509978A JP10509978A JPS5531184A JP S5531184 A JPS5531184 A JP S5531184A JP 10509978 A JP10509978 A JP 10509978A JP 10509978 A JP10509978 A JP 10509978A JP S5531184 A JPS5531184 A JP S5531184A
Authority
JP
Japan
Prior art keywords
gold
potassium
plating soln
kcn
koh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10509978A
Other languages
Japanese (ja)
Inventor
Yoshinori Takakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10509978A priority Critical patent/JPS5531184A/en
Publication of JPS5531184A publication Critical patent/JPS5531184A/en
Pending legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To provide a stable nonelectrolytic gold-plating soln. with high gold- depositing rate compared with conventional plating soln., by the addn. of potassium borohydride in a specific ratio as a reducing agent to a soln. contg. specific amounts of potassium gold cyanide, KOH, and KCN.
CONSTITUTION: A nonelectrolytic gold-plating soln. comprising 0.1W0.4mol KOH, 0.1mol KCN, and a prescribed amount f potassium gold cyanide, further contg. 0.1W0.2mol potassium borohydride as a reducing agent. The plating soln. contg., e.g., 0.2mol KOH, 0.2mol potassium borohydride, and prescribed amounts of potassium gold cyanide and KCN shows the largest deposition rate of gold, e.g., about 10μ in one hr, 3μ or more in 10min. This plating soln. makes it easy to control the thickness of plated layer, and yields a plated gold coating of high purity.
COPYRIGHT: (C)1980,JPO&Japio
JP10509978A 1978-08-29 1978-08-29 Nonelectrolytic gold-plating solution Pending JPS5531184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10509978A JPS5531184A (en) 1978-08-29 1978-08-29 Nonelectrolytic gold-plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10509978A JPS5531184A (en) 1978-08-29 1978-08-29 Nonelectrolytic gold-plating solution

Publications (1)

Publication Number Publication Date
JPS5531184A true JPS5531184A (en) 1980-03-05

Family

ID=14398440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10509978A Pending JPS5531184A (en) 1978-08-29 1978-08-29 Nonelectrolytic gold-plating solution

Country Status (1)

Country Link
JP (1) JPS5531184A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS503743A (en) * 1973-05-16 1975-01-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS503743A (en) * 1973-05-16 1975-01-16

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