JPS5529164A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPS5529164A JPS5529164A JP10263578A JP10263578A JPS5529164A JP S5529164 A JPS5529164 A JP S5529164A JP 10263578 A JP10263578 A JP 10263578A JP 10263578 A JP10263578 A JP 10263578A JP S5529164 A JPS5529164 A JP S5529164A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- electrode
- bonding
- slice
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To make twice or more bonding operations unnecessary and to do away with only one hot pressing by fitting in advance on the tip of lead frame for bonding electrode with which a semiconductor element is provided.
CONSTITUTION: To provide in advance the tip of the lead frame for bonding electrode of semiconductor element 6 with a copper slice 5 corresponding to the inner lead facing the electrode of the element 6. For doing so, the copper slice is to be welded on the surface of the lead frame, next the etching with chemicals or the press with a press mold is to be performed. Thereafter the electrode of the element 6 and the slice will be set in the same position and bonded. In this way the twice or more bonding operations are not required and the connection will be finished with simply one hot pressing. Moreover, the outer lead will not be needed.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10263578A JPS5529164A (en) | 1978-08-22 | 1978-08-22 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10263578A JPS5529164A (en) | 1978-08-22 | 1978-08-22 | Lead frame for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5529164A true JPS5529164A (en) | 1980-03-01 |
Family
ID=14332690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10263578A Pending JPS5529164A (en) | 1978-08-22 | 1978-08-22 | Lead frame for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5529164A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4826186A (en) * | 1971-08-05 | 1973-04-05 |
-
1978
- 1978-08-22 JP JP10263578A patent/JPS5529164A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4826186A (en) * | 1971-08-05 | 1973-04-05 |
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