JPS5529164A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5529164A
JPS5529164A JP10263578A JP10263578A JPS5529164A JP S5529164 A JPS5529164 A JP S5529164A JP 10263578 A JP10263578 A JP 10263578A JP 10263578 A JP10263578 A JP 10263578A JP S5529164 A JPS5529164 A JP S5529164A
Authority
JP
Japan
Prior art keywords
lead frame
electrode
bonding
slice
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10263578A
Other languages
Japanese (ja)
Inventor
Seiji Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP10263578A priority Critical patent/JPS5529164A/en
Publication of JPS5529164A publication Critical patent/JPS5529164A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To make twice or more bonding operations unnecessary and to do away with only one hot pressing by fitting in advance on the tip of lead frame for bonding electrode with which a semiconductor element is provided.
CONSTITUTION: To provide in advance the tip of the lead frame for bonding electrode of semiconductor element 6 with a copper slice 5 corresponding to the inner lead facing the electrode of the element 6. For doing so, the copper slice is to be welded on the surface of the lead frame, next the etching with chemicals or the press with a press mold is to be performed. Thereafter the electrode of the element 6 and the slice will be set in the same position and bonded. In this way the twice or more bonding operations are not required and the connection will be finished with simply one hot pressing. Moreover, the outer lead will not be needed.
COPYRIGHT: (C)1980,JPO&Japio
JP10263578A 1978-08-22 1978-08-22 Lead frame for semiconductor device Pending JPS5529164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10263578A JPS5529164A (en) 1978-08-22 1978-08-22 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10263578A JPS5529164A (en) 1978-08-22 1978-08-22 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5529164A true JPS5529164A (en) 1980-03-01

Family

ID=14332690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10263578A Pending JPS5529164A (en) 1978-08-22 1978-08-22 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5529164A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826186A (en) * 1971-08-05 1973-04-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826186A (en) * 1971-08-05 1973-04-05

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