JPS5523181A - Adhesive sheet - Google Patents
Adhesive sheetInfo
- Publication number
- JPS5523181A JPS5523181A JP8172179A JP8172179A JPS5523181A JP S5523181 A JPS5523181 A JP S5523181A JP 8172179 A JP8172179 A JP 8172179A JP 8172179 A JP8172179 A JP 8172179A JP S5523181 A JPS5523181 A JP S5523181A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- epoxy resin
- adhesive
- adherends
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To manufacture an adhesive sheet useful for the uniform bonding and sealing of a hybrid IC without using a coating process, by impregnating a nonwoven sheet with a liquid epoxy resin, and solidifying the epoxy resin.
CONSTITUTION: A non-woven fabric sheet 11 of about 150μ thickness made of paper or synthetic fiber such as polyester, is impregnated with a liquid epoxy resin 12 as an adhesive resin. The impregnated sheet is solidified by evaporating the solvent of the adhesive resin 12, and punched out to a desired shape. The punched piece of the sheet is inserted between adherends, and hot-pressed to effect the bonding and sealing of the adherends.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8172179A JPS5523181A (en) | 1979-06-27 | 1979-06-27 | Adhesive sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8172179A JPS5523181A (en) | 1979-06-27 | 1979-06-27 | Adhesive sheet |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12737572A Division JPS4982968A (en) | 1972-12-18 | 1972-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5523181A true JPS5523181A (en) | 1980-02-19 |
Family
ID=13754272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8172179A Pending JPS5523181A (en) | 1979-06-27 | 1979-06-27 | Adhesive sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5523181A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01122049U (en) * | 1988-02-10 | 1989-08-18 | ||
JPH0286675A (en) * | 1988-09-22 | 1990-03-27 | Nitto Denko Corp | Fixing material for printed circuit board |
-
1979
- 1979-06-27 JP JP8172179A patent/JPS5523181A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01122049U (en) * | 1988-02-10 | 1989-08-18 | ||
JPH0286675A (en) * | 1988-09-22 | 1990-03-27 | Nitto Denko Corp | Fixing material for printed circuit board |
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