JPS5519861A - Manufacture of semiconductor element container - Google Patents

Manufacture of semiconductor element container

Info

Publication number
JPS5519861A
JPS5519861A JP9283778A JP9283778A JPS5519861A JP S5519861 A JPS5519861 A JP S5519861A JP 9283778 A JP9283778 A JP 9283778A JP 9283778 A JP9283778 A JP 9283778A JP S5519861 A JPS5519861 A JP S5519861A
Authority
JP
Japan
Prior art keywords
rings
plate
prescribed
small pieces
metallization material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9283778A
Other languages
Japanese (ja)
Inventor
Hiroyuki Nagao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9283778A priority Critical patent/JPS5519861A/en
Publication of JPS5519861A publication Critical patent/JPS5519861A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To solder on a metallic base the small pieces made by accurately cutting the plate whose upper and lower surfaces are merallized, for preventing the attachment of metallization material to the side faces of rings.
CONSTITUTION: Metallization material 13 is applied on the upper and lower surfaces of the plate 12a having prescribed thickness (t) which plate 12 is made of alumina for example, and sintered. Next, said plate 12a is cut into small rectangular pieces 12c. Next, a plurality of said small pieces 12c are combined with each other by adhesive, and a hole 12e with a prescribed inner diameter is made at the central portion of thus-obtained work by rotational grinding method. Next, small pieces are cut 12 so that the outer shape thereof may become so circular as prescribed and separated into rings 12. Next, said rings 12 are soldered on a metallic base. Therein, said metallization material 13 does not attach on the side faces of said rings 12. Further, no error occurs to the outer diameter of said rings 12 since the working thereof can be made very accurately in size.
COPYRIGHT: (C)1980,JPO&Japio
JP9283778A 1978-07-28 1978-07-28 Manufacture of semiconductor element container Pending JPS5519861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9283778A JPS5519861A (en) 1978-07-28 1978-07-28 Manufacture of semiconductor element container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9283778A JPS5519861A (en) 1978-07-28 1978-07-28 Manufacture of semiconductor element container

Publications (1)

Publication Number Publication Date
JPS5519861A true JPS5519861A (en) 1980-02-12

Family

ID=14065534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9283778A Pending JPS5519861A (en) 1978-07-28 1978-07-28 Manufacture of semiconductor element container

Country Status (1)

Country Link
JP (1) JPS5519861A (en)

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