JPS5541720A - Preparation of stud base for semiconductor device - Google Patents

Preparation of stud base for semiconductor device

Info

Publication number
JPS5541720A
JPS5541720A JP11412778A JP11412778A JPS5541720A JP S5541720 A JPS5541720 A JP S5541720A JP 11412778 A JP11412778 A JP 11412778A JP 11412778 A JP11412778 A JP 11412778A JP S5541720 A JPS5541720 A JP S5541720A
Authority
JP
Japan
Prior art keywords
stud
swelling
extruding machine
metal
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11412778A
Other languages
Japanese (ja)
Other versions
JPS598066B2 (en
Inventor
Tokuo Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP11412778A priority Critical patent/JPS598066B2/en
Publication of JPS5541720A publication Critical patent/JPS5541720A/en
Publication of JPS598066B2 publication Critical patent/JPS598066B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Forging (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To provide a stud having an increased allowable fastening torque useful in a semiconductor device by preparing the stud following the soldering of a molybdenum plate and treating the stud material in the hardened state by an extruding machine.
CONSTITUTION: A prepared working material of composite metal 10 consisting of a thick layer 12 of a highly conducting metal, such as copper or zirconium steel, and overlying same a thin layer 14 of a highly weldable metal, such as nickel or cupronickel, is treated by punching into a disc-like shape, which is then applied on a backwardly extruding machine 22, to form a swelling 16 at the top and, at the same time, to have a polygonal configuration of the outer circumference. A ring-like protrusion 17 to which a shell is to be joined by projection welding is formed on the surface around the swelling 16. The upper surface of the swelling 16 is cut to form a level surface to expose the underlying metallic layer 12, while a molybdenum plate 18 is silver-sldered onto the levelled surface of the swelling 16. Finally, push the thus treated composite metal 10 further backward in the extruding machine 22, and there is formed a stud 30, the allowable fastening torque of which is much increased.
COPYRIGHT: (C)1980,JPO&Japio
JP11412778A 1978-09-19 1978-09-19 Manufacturing method of stud base for semiconductor device Expired JPS598066B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11412778A JPS598066B2 (en) 1978-09-19 1978-09-19 Manufacturing method of stud base for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11412778A JPS598066B2 (en) 1978-09-19 1978-09-19 Manufacturing method of stud base for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5541720A true JPS5541720A (en) 1980-03-24
JPS598066B2 JPS598066B2 (en) 1984-02-22

Family

ID=14629805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11412778A Expired JPS598066B2 (en) 1978-09-19 1978-09-19 Manufacturing method of stud base for semiconductor device

Country Status (1)

Country Link
JP (1) JPS598066B2 (en)

Also Published As

Publication number Publication date
JPS598066B2 (en) 1984-02-22

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