JPS5487170A - Dicing unit - Google Patents

Dicing unit

Info

Publication number
JPS5487170A
JPS5487170A JP15454177A JP15454177A JPS5487170A JP S5487170 A JPS5487170 A JP S5487170A JP 15454177 A JP15454177 A JP 15454177A JP 15454177 A JP15454177 A JP 15454177A JP S5487170 A JPS5487170 A JP S5487170A
Authority
JP
Japan
Prior art keywords
whetstone
whetstones
cutting
smaller
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15454177A
Other languages
Japanese (ja)
Inventor
Shigeru Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15454177A priority Critical patent/JPS5487170A/en
Publication of JPS5487170A publication Critical patent/JPS5487170A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To perform cutting with good accuracy and massproduction by providing a plurality of whetstones along the direction forming cutting.
CONSTITUTION: The substrate 6 is bonded on the stage 6 and the whetstones 25 and 26 are mounted. Cutting is formed by reciprocating the table. Machining is made by setting the thickness t of the whetstone 25 thicker than the whitstone 26 and the cutting depth d of the whetstone 25 deeper than that of the whetstone 26. By turning the whetstone 25 clockwise, the substrate is fed circumferentially, and the whetstone 26 is turned counterclockwise, then notch and crack can be prevented. With this method, the load of spindle is smaller in comparison with the case installing a number of whetstones on the same shaft, and adjustment and mounting are easier. When the thickness of whetstones is made smaller in the order of treatment, the working resistance and heat dissipation are smaller and the accuracy can be increased
COPYRIGHT: (C)1979,JPO&Japio
JP15454177A 1977-12-23 1977-12-23 Dicing unit Pending JPS5487170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15454177A JPS5487170A (en) 1977-12-23 1977-12-23 Dicing unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15454177A JPS5487170A (en) 1977-12-23 1977-12-23 Dicing unit

Publications (1)

Publication Number Publication Date
JPS5487170A true JPS5487170A (en) 1979-07-11

Family

ID=15586504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15454177A Pending JPS5487170A (en) 1977-12-23 1977-12-23 Dicing unit

Country Status (1)

Country Link
JP (1) JPS5487170A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578227U (en) * 1980-06-17 1982-01-16
JPS60226420A (en) * 1984-04-19 1985-11-11 Nippon Sheet Glass Co Ltd Method of cutting of plate material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578227U (en) * 1980-06-17 1982-01-16
JPS60226420A (en) * 1984-04-19 1985-11-11 Nippon Sheet Glass Co Ltd Method of cutting of plate material

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