JPS5519860A - Manufacture of semiconductor element container - Google Patents

Manufacture of semiconductor element container

Info

Publication number
JPS5519860A
JPS5519860A JP9283678A JP9283678A JPS5519860A JP S5519860 A JPS5519860 A JP S5519860A JP 9283678 A JP9283678 A JP 9283678A JP 9283678 A JP9283678 A JP 9283678A JP S5519860 A JPS5519860 A JP S5519860A
Authority
JP
Japan
Prior art keywords
rings
solder
pieces
solder member
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9283678A
Other languages
Japanese (ja)
Inventor
Hideyo Hasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9283678A priority Critical patent/JPS5519860A/en
Publication of JPS5519860A publication Critical patent/JPS5519860A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To eliminate the necessity of new solder sheet by working the plate having previously-melted solder member on the surfaces thereof into pieces with required shape and size for preventing solder attachment to the side faces thereof so that parasitic electrostatic capacity is uniformed.
CONSTITUTION: Metallized layers 12 are formed on the upper and lower surfaces of the plate made of alumina for example. Next, solder member 13 is melted thereon. Next, said plate 11a is cut into small rectangular pieces 11c. Next, a plurality of said pieces are combined with each other by adhesive, and a circular hole is made at the center of thus-obtained work by rotational grinding method. Next, said small pieces 11c are cut so that the outer shape thereof may become so circular as prescribed, and separated into rings 11. Consequently, said rings 11 require no solder sheet since said solder member 13 is on the upper and lower surfaces thereof, and said solder member 13 does not fly up onto the inner and outer side faces of said rings 11 during soldering. When said rings 11 are assembled into an ultrahigh- frequency semiconductor container, therefore, parasitic electrostatic capacity can be uniformed as designed.
COPYRIGHT: (C)1980,JPO&Japio
JP9283678A 1978-07-28 1978-07-28 Manufacture of semiconductor element container Pending JPS5519860A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9283678A JPS5519860A (en) 1978-07-28 1978-07-28 Manufacture of semiconductor element container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9283678A JPS5519860A (en) 1978-07-28 1978-07-28 Manufacture of semiconductor element container

Publications (1)

Publication Number Publication Date
JPS5519860A true JPS5519860A (en) 1980-02-12

Family

ID=14065506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9283678A Pending JPS5519860A (en) 1978-07-28 1978-07-28 Manufacture of semiconductor element container

Country Status (1)

Country Link
JP (1) JPS5519860A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6371053A (en) * 1986-09-12 1988-03-31 Isamu Miura Nethod of reversing paper for paper aligning device and mechanism for reversing paper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6371053A (en) * 1986-09-12 1988-03-31 Isamu Miura Nethod of reversing paper for paper aligning device and mechanism for reversing paper

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