JPS55156341A - Resin composition for realing electronic parts - Google Patents

Resin composition for realing electronic parts

Info

Publication number
JPS55156341A
JPS55156341A JP6368279A JP6368279A JPS55156341A JP S55156341 A JPS55156341 A JP S55156341A JP 6368279 A JP6368279 A JP 6368279A JP 6368279 A JP6368279 A JP 6368279A JP S55156341 A JPS55156341 A JP S55156341A
Authority
JP
Japan
Prior art keywords
resin
electronic parts
epoxy resin
composition
thixotropic agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6368279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS613098B2 (esLanguage
Inventor
Yoshio Nakatani
Akihiro Okuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6368279A priority Critical patent/JPS55156341A/ja
Publication of JPS55156341A publication Critical patent/JPS55156341A/ja
Publication of JPS613098B2 publication Critical patent/JPS613098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/47—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP6368279A 1979-05-23 1979-05-23 Resin composition for realing electronic parts Granted JPS55156341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6368279A JPS55156341A (en) 1979-05-23 1979-05-23 Resin composition for realing electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6368279A JPS55156341A (en) 1979-05-23 1979-05-23 Resin composition for realing electronic parts

Publications (2)

Publication Number Publication Date
JPS55156341A true JPS55156341A (en) 1980-12-05
JPS613098B2 JPS613098B2 (esLanguage) 1986-01-30

Family

ID=13236373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6368279A Granted JPS55156341A (en) 1979-05-23 1979-05-23 Resin composition for realing electronic parts

Country Status (1)

Country Link
JP (1) JPS55156341A (esLanguage)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608014U (ja) * 1983-06-29 1985-01-21 カルソニックカンセイ株式会社 座板一体型ラジエ−タ用金型
JPS60163982A (ja) * 1984-02-03 1985-08-26 Nippon Soda Co Ltd 封着用熱硬化性樹脂組成物
JPS641771A (en) * 1987-06-25 1989-01-06 Somar Corp Epoxy resin powder coating composition
US4992488A (en) * 1986-05-07 1991-02-12 Ciba-Geigy Corporation Glass fibre-reinforced epoxide resin moulding composition and its use
JP2012059731A (ja) * 2010-09-03 2012-03-22 Kyocera Chemical Corp サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608014U (ja) * 1983-06-29 1985-01-21 カルソニックカンセイ株式会社 座板一体型ラジエ−タ用金型
JPS60163982A (ja) * 1984-02-03 1985-08-26 Nippon Soda Co Ltd 封着用熱硬化性樹脂組成物
US4992488A (en) * 1986-05-07 1991-02-12 Ciba-Geigy Corporation Glass fibre-reinforced epoxide resin moulding composition and its use
JPS641771A (en) * 1987-06-25 1989-01-06 Somar Corp Epoxy resin powder coating composition
JP2012059731A (ja) * 2010-09-03 2012-03-22 Kyocera Chemical Corp サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ

Also Published As

Publication number Publication date
JPS613098B2 (esLanguage) 1986-01-30

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