JPS613098B2 - - Google Patents
Info
- Publication number
- JPS613098B2 JPS613098B2 JP54063682A JP6368279A JPS613098B2 JP S613098 B2 JPS613098 B2 JP S613098B2 JP 54063682 A JP54063682 A JP 54063682A JP 6368279 A JP6368279 A JP 6368279A JP S613098 B2 JPS613098 B2 JP S613098B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/47—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6368279A JPS55156341A (en) | 1979-05-23 | 1979-05-23 | Resin composition for realing electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6368279A JPS55156341A (en) | 1979-05-23 | 1979-05-23 | Resin composition for realing electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55156341A JPS55156341A (en) | 1980-12-05 |
| JPS613098B2 true JPS613098B2 (esLanguage) | 1986-01-30 |
Family
ID=13236373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6368279A Granted JPS55156341A (en) | 1979-05-23 | 1979-05-23 | Resin composition for realing electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55156341A (esLanguage) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608014U (ja) * | 1983-06-29 | 1985-01-21 | カルソニックカンセイ株式会社 | 座板一体型ラジエ−タ用金型 |
| JPS60163982A (ja) * | 1984-02-03 | 1985-08-26 | Nippon Soda Co Ltd | 封着用熱硬化性樹脂組成物 |
| ES2014327B3 (es) * | 1986-05-07 | 1990-07-01 | Ciba-Geigy Ag | Compuesto de moldeo de resina epoxi reforzada con fibra de vidrio y su empleo. |
| JPH07100766B2 (ja) * | 1987-06-25 | 1995-11-01 | ソマール株式会社 | エポキシ樹脂粉体塗料組成物 |
| JP5530313B2 (ja) * | 2010-09-03 | 2014-06-25 | 京セラケミカル株式会社 | サーミスタセンサ注形用樹脂組成物及びサーミスタセンサ |
-
1979
- 1979-05-23 JP JP6368279A patent/JPS55156341A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55156341A (en) | 1980-12-05 |